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Epitaxial lateral overgrowth of GaN on 4 inch Si(111) by MOVPE

机译:通过MOVPE在4英寸Si(111)上外延生长GaN

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Epitaxial Lateral Overgrowth (ELOG) of GaN on 4 inch sili-con(111) substrates by MOVPE was investigated in this study. ELOG was performed on a GaN template with a couple of AlGaN intermediate layers (IL) on an A1N nucleation layer. The AlGaN ILs supply compressive stress to the top GaN template and thereafter to the ELOG layer. Consequently, layer cracking is minimized. Two masks were used in this work: a 2 inch wagon wheel mask and a 4 inch maskrnwith parallel stripes of various filling factors and periods. The filling factor is varied from 0.33 to 0.7. The periodic spacing is in the range of 6 μm to 10 μm. Temperature, V/III ratio, pressure and stripe orientation were optimized to achieve fastest lateral growth rate. The highest lateral to vertical ratio can be more than 4. A fully coalesced layer within the critical thickness for a crack-free layer was achieved on 4 inch silicon substrates.
机译:本研究研究了MOVPE在4英寸硅(111)衬底上GaN的外延横向过生长(ELOG)。在GaN模板上执行ELOG,该GaN模板在AlN成核层上具有一对AlGaN中间层(IL)。 AlGaN IL向顶部GaN模板,然后向ELOG层提供压缩应力。因此,层破裂最小化。在这项工作中使用了两个口罩:一个2英寸的马车车轮口罩和一个4英寸的带有不同填充因子和周期的平行条纹的口罩。填充系数从0.33到0.7不等。周期性间隔在6μm至10μm的范围内。优化了温度,V / III比,压力和条纹方向,以实现最快的横向生长速度。最高的纵横比可以大于4。在4英寸的硅基板上,在无裂纹层的临界厚度内达到了完全聚结的层。

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