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Study on mechanically alloyed tin telluride screen-printed films for optoelectronic device applications

机译:用于机械合金化锡碲化型丝网印刷薄膜的光电器件应用

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摘要

Narrow band gap semiconductor tin telluride (SnTe) was synthesized by mechanical alloying and its film was deposited on glass substrates by the economically and commercially feasible screen-printing technique. Deposition of the film was followed by sintering. Different analytical techniques were utilized to study the structure, surface morphology, elemental, optical and electrical characteristics of the film X-ray diffraction analysis confirms that the film is polycrystalline in nature and exhibits rock salt type structure with preferred orientation of grains along (200) direction. EDAX spectrum confirms the presence of Sn and Te elements in the film SEM image shows that the film exhibits uniform surface. The energy band gap of the film was determined by reflection spectra. The film is found to have a direct band gap of 0.37 eV. The dark electrical conductivity and activation energy of the film were measured in temperature range 300-380 K. Hall Effect measurement indicates that the film has p-type electrical conductivity.
机译:通过经济上和商业上可行的丝网印刷技术,通过机械合金化合并窄带间隙半导体锡碲化肽(SNTE),并通过经济和商业上可行的丝网印刷技术沉积在玻璃基板上。沉积薄膜后烧结。利用不同的分析技术研究薄膜X射线衍射分析的结构,表面形态,元素,光学和电气特性证实,薄膜是多晶的性质,并展示诸如谷物的优选取向(200)的岩盐型结构方向。 EDAX光谱证实薄膜SEM图像中Sn和TE元素的存在表明膜表现出均匀的表面。通过反射光谱测定膜的能带隙。薄膜被发现具有0.37eV的直接带隙。在温度范围为300-380k的温度范围内测量薄膜的暗导电性和激活能量。霍尔效应测量表明膜具有p型导电性。

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