Nanostructure and adhesion of electroless-plated Cu film on the self-catalyzed Cu using metal-plasma ion implanter

摘要

Metal-plasma ion implanter has been used in this research to insert Cu ions as self-catalyst into the sub-surface of the TaN/FSG/Si assembly for electroless-plated Cu film. Cu ions were first implanted using two dosages of 5.0 x 10(16) and 10 X 10(16) cm(-2) at accelerating voltages of 30, 40, and 50 kV.The specimens were characterized by field emission scanning electron microscopy, atomic force microscopy, and mechanical pull-up tests. A noticed relationship between the implanted voltage and the nanostructure of the implanted Cu was established. The effects of the implanted nanostructure related to the adhesion strength of the electroless-plated Cu film were discussed. The adhesion strength of the final electroless-plated Cu film followed with the implanted dosage of 10 X 10(16) cm(-2) is apparently higher than that with the dosage of 5.0 x 10(16) cm(-2) at the same accelerating voltage. The adhesion strength of the Cu films tends to decrease with the increasing accelerating voltages applied for the implantation. An excellent gap-filling capability in a 0.2 mu m width (aspect ratio 7:1) via was obtained. (c) 2005 Elsevier B.V. All rights reserved.