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Metal vapor vacuum-arc ion implantation effects on the adhesion and hardness of ion-beam deposited Cr/Cu films

机译:金属蒸气真空电弧离子注入对离子束沉积Cr / Cu膜附着力和硬度的影响

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摘要

Two groups of Cr/Cu multilayer films were deposited on surfaces of Si (1 0 0) crystal and Al_2O_3 ceramic, respectively. One group was prepared by both metal vapor vacuum-arc (MEVVA) ion implantation and ion beam assistant deposition (IBAD) technologies with different sputtering ion densities and deposition times. The other group was prepared only by IBAD. The morphologies of the Cr/Cu films and cross-section micrographs were observed by scanning electron microscopy (SEM). Nanohardness, modulus, and adhesive strength of the Cr/Cu films were measured by a nano-indenter. Continuous stiffness measurement (CSM) was used while measuring nanohardness and modulus of the samples. The experimental data indicate that the adhesive strength of the samples prepared with MEVVA ion implantation was about 3-3.5 times higher than one of the corresponding samples prepared without MEVVA ion implantation. The nanohardness and modulus of the Cr/Cu films were obviously affected by the test parameters and substrate kind.
机译:两组Cr / Cu多层膜分别沉积在Si(1 0 0)晶体和Al_2O_3陶瓷的表面上。通过金属蒸气真空电弧(MEVVA)离子注入和离子束辅助沉积(IBAD)技术制备了一组,具有不同的溅射离子密度和沉积时间。另一组仅由IBAD准备。通过扫描电子显微镜(SEM)观察到Cr / Cu膜的形态和横截面显微照片。 Cr / Cu膜的纳米硬度,模量和粘合强度通过纳米压头测量。在测量样品的纳米硬度和模量时,使用连续刚度测量(CSM)。实验数据表明,用MEVVA离子注入制备的样品的粘合强度是未用MEVVA离子注入制备的相应样品之一的约3-3.5倍。 Cr / Cu膜的纳米硬度和模量明显受测试参数和基材种类的影响。

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