High-Performance FCBGA Based on Ultra-Thin Packaging Substrate

摘要

We developed a high-performance Flip-Chip Ball Grid Array (FCBGA) based on an ultra-thin, high-density packaging substrate called a Multi-Layer Thin Substrate (MLTS) in order to meet the high demand for high-density, high-performance, and low-cost LSI packages. The most important feature of the package is that it has a high-density, high-performance MLTS formed by removing a metal plate after mounting an LSI chip on it. A prototype high-density FCBGA exhibited excellent long-term reliability. The electrical simulation results indicate that the MLTS packaging technology has the advantage of excellent high-frequency properties compared with a FCBGA using a conventional build-up PWB substrate.