HANDLE GaAs AND GaN MMICs WITH CARE

摘要

PROPER PROCEDURES MUST be used when building integrated assemblies that incorporate gallium-arsenide (GaAs) or gallium-nitride (GaN) monolithic microwave integrated circuits (MMICs). Hence, this topic is the subject of Qorvo's white paper titled, "GaAs and GaN Die Assembly and Handling Procedures." In it, Qorvo discusses component placement, attachment, and interconnect techniques that can be utilized to successfully build assemblies containing GaAs or GaN MMICs.