A Low Loss Dielectric for High Frequency HDI Substrates and PCBs

摘要

The wireless telecommunications market continues to require denser circuitry and higher I/O count chip packages to meet ever growing performance requirements. These new requirements can only be satisfied with multilayer PCBs incorporating RF and microwave, as well as digital signal processing circuitry on the same high density interconnect (HDI) multilayer circuit board. These multilayer PCBs are used in applications from Bluetooth modules to base stations and consist of thin dielectric layers interconnected with microvias. The dielectric layers are sequentially laminated on FR-4 or other conventional cores to make up the mixed signal multilayer PCB.