Development of a Low Loss, High Dielectric Strength Microwave Substrate

摘要

This work describes a comparison of two candidate materials for pulse forming line fabrication with respect to bulk dielectric breakdown, frequency response of relative permittivity, and dielectric loss. One material is a commercially available microwave substrate material that can be procured in sheet form without a high voltage specification, while the other is a newly developed material that also comes in sheet form that can also be cast between the electrodes.