Micromachined silicon via-holes and interdigital bandpass filters

摘要

Several through-silicon-substrate-via-holes used in microwave circuits are analyzed. The silicon via-holes have been fabricated by inductively coupled plasma (ICP) process. Using via-holes for microstrip transmission lines, a micromachined Ku-band interdigital filter has been designed, fabricated, and tested. It achieved an insertion loss of −2.4 dB, and a 3 dB fractional bandwidth of 8%. This filter has the advantages of small sizes and relatively outstanding RF performance.