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Reliability assessment and failure mode analysis of MEMS accelerometers for space applications

机译:航天应用MEMS加速度计的可靠性评估和故障模式分析

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In the present work, the reliability assessment of capacitive MEMS accelerometers of 3 different suppliers (codenamed A, B, and C) for their use in space applications was performed. The developed reliability assessment testing program addressed specific severities of space missions, such as mechanical shocks and vibrations during take-off and rocket stages separation, high temperature gradients and radiation endurance during in-orbit operation. The main aim of the testing was to evaluate the robustness and reliability limits of MEMS devices by overstressing their specific properties through dedicated tests. Typical failures modes were analyzed and root-causes identified on the devices' subsystem level: MEMS structure, ASIC, interconnecting wires, and package. Overall results of the performed reliability assessment tests and failure mode analyses suggest that the most specific MEMS components, namely the microstructures, do not themselves constitute the failure causes. Following the observations, other components, e.g. interconnects, ASIC or packaging, exhibit lower reliability limits to the specific stresses of the space harsh conditions. Comparative analysis of three accelerometers from various suppliers (designs A, B, and C) suggests the design A (in a hermetic ceramic package) to exhibit the best overall reliability for space-specific application conditions. Design B also shows good robustness. However, its non-hermetic packaging makes it unsuitable for the direct use for space applications in the current state. Utilization of a hermetic package and improvement of the wire-bonding temperature resistance would significantly improve this design. Accelerometers of supplier C (in a hermetic ceramic package) have a trend of occasional “infant mortality” early failures. It is therefore very important to perform burn-in and initial pre-screening for these devices. Another strong weak point for this design is related to a low radiation endurance, which shall be significantly improved.
机译:在当前的工作中,进行了3​​种不同供应商(代号A,B和C)的电容MEMS加速度计在太空应用中的可靠性评估。制定的可靠性评估测试程序解决了特定的太空任务严重性问题,例如起飞和火箭阶段分离过程中的机械冲击和振动,在轨运行过程中的高温梯度和辐射耐受性。测试的主要目的是通过专用测试过分强调其特定性能,从而评估MEMS器件的鲁棒性和可靠性极限。在设备子系统级别上分析了典型的故障模式并确定了根本原因:MEMS结构,ASIC,互连线和封装。进行的可靠性评估测试和故障模式分析的总体结果表明,最具体的MEMS组件(即微结构)本身并不构成故障原因。根据观察结果,其他组成部分,例如互连,ASIC或封装对空间苛刻条件下的特定应力表现出较低的可靠性限制。对来自不同供应商(设计A,B和C)的三个加速度计的比较分析表明,设计A(采用密封陶瓷封装)在针对特定空间的应用条件下表现出最佳的整体可靠性。设计B也显示出良好的鲁棒性。但是,其非密封包装使其不适合在当前状态下直接用于太空应用。利用密封封装和改善引线键合耐高温性将显着改善该设计。供应商C的加速度计(采用密封陶瓷包装)具有一种“婴儿死亡率”早期失效的趋势。因此,对这些设备执行预烧和初始预筛选非常重要。此设计的另一个明显弱点是与低辐射耐力有关,应将其显着提高。

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