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Electrical characterization of the Au/InP(100) and Au/InSb/InP(100) structures

机译:Au / InP(100)和Au / InSb / InP(100)结构的电特性

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In this work, we measure the current-voltage (I-V) and the capacitance-voltage (C-V) characteristics of the Au/InP(100) and Au/InSb/InP(100) Schottky type diodes. The InP(n) substrate is restructured by some monolayers of the InSb thin film. We then propose a study of the electrical quality of the elaborated components after the Au/InP interface creation; first without annealing and then after annealing by heating at 500 deg C temperatures. Analysis of the measured I(V) characteristics for the Au/InP and Au/InSb/InP samples allows the determination of the electrical parameter variations. The saturation current I_s, the serial resistance R_s, the mean ideality factor n and also the barrier height ф_Bn, are respectively equal to 2.10 x 10~-4 A, 19Ω, 1.8 and 0.401 eV for the Au/InP sample and equal to 1.34 x 10~-7 A, 175 Ω, 1.78 and 0.592 eV for the Au/heated InSb/InP. Another good result is that the analysis and simulation of the I(V) and the C(V) characteristics allows us to determine the very important mean interfacial state density N_ss(mean), and is obtained to be equal 4.23 x 10~12 eV~-1 cm~-2 for the Au/InP sample and equal to 4.42 x 10~12 eV~-1 cm~-2 for the Au/heated InSb/InP. This work thus permits the evolution study of these electrical parameters related to the restructuration conditions.
机译:在这项工作中,我们测量了Au / InP(100)和Au / InSb / InP(100)肖特基二极管的电流-电压(I-V)和电容-电压(C-V)特性。 InP(n)衬底通过InSb薄膜的某些单层结构进行重组。然后,我们提出了在创建Au / InP接口后对精心制作的组件的电气质量进行研究的方法。首先不进行退火,然后在500摄氏度的温度下进行退火。对Au / InP和Au / InSb / InP样品的测量的I(V)特性进行分析可以确定电参数的变化。 Au / InP样品的饱和电流I_s,串联电阻R_s,平均理想因子n和势垒高度ф_Bn分别等于2.10 x 10〜-4 A,19Ω,1.8和0.401 eV,等于1.34 Au /加热的InSb / InP的x 10〜-7 A,175Ω,1.78和0.592 eV。另一个很好的结果是对I(V)和C(V)特性的分析和仿真使我们能够确定非常重要的平均界面态密度N_ss(mean),并获得等于4.23 x 10〜12 eV Au / InP样品约为〜-1 cm〜-2,Au /加热的InSb / InP等于4.42 x 10〜12 eV〜-1 cm〜-2。因此,这项工作允许对与重组条件有关的这些电参数进行演化研究。

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