Flattening ability of a vacuum pin chuck around the periphery of a processed wafer

摘要

To resolve ultra-fine patterns of 0.13 μm or less, chucking accuracy must be within±0.05 μm except 1 mm from the wafer edge. This paper describes the contact distribution between the back surface of a wafer and a chuck surface measured after clamping and vacuum-pin-chuck flattening ability around the periphery of a processed wafer calculated with the finite element method.