SPIN CHUCK DEVICE FOR A SINGLE WAFER PROCESSING DEVICE AND A METHOD OF OPERATING A CHUCK PIN THEREOF, CAPABLE OF MAKING ROTATION OF A SPIN CHUCK AND AN OPERATION OF A WAFER CHUCK PIN SMOOTH

摘要

PURPOSE: A spin chuck device for a single wafer processing device and a method of operating a chuck pin thereof are provided to control rotation of a driving shaft member and an operation of a chuck pin by one driving device, thereby realizing a selective operation of the chuck pin using an existing brake for slowing down the driving shaft member.;CONSTITUTION: A spin chuck device(100) for a single wafer processing device includes a chuck, a ring gear, a chuck pin, a driving shaft member and a brake. The chuck(110) provides a support surface for supporting a wafer. The ring gear(120) can relatively rotate for the chuck. The chuck pins(130) are partially exposed from the support surface of the chuck. The chuck pins are driven by a ring gear. The driving shaft member(140) transfers rotation to the chuck and the ring gear. The brake(160) controls the rotation of the chuck.;COPYRIGHT KIPO 2010