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Chemically conformal deposition of SrTiO_3 thin films by Atomic Layer Deposition using conventional metal organic precursors and remote-plasma activated H_2O

机译:使用常规金属有机前体和远程等离子体活化的H_2O,通过原子层沉积化学共形沉积SrTiO_3薄膜

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Chemically conformal deposition of SrTiO_3 (STO) thin films was successfully achieved by ALD using conventional metal organic precursors and remote-plasma activated H_2O. It was found that the ALD behavior of the STO film was critically dependent on the Sr(thd)_2 source bubbling temperature. When the Sr-source bubbling temperature was < ~ 200℃ (Sr(thd)_2 melting temperature), the deposition proceeded in a genuine ALD mode and stoichiometric STO films were deposited with a good process reliability. Relatively good electrical properties were obtained from a planar capacitor structure with Pt top and Ru bottom electrodes. A 19.5-nm-thick STO film showed an equivalent oxide thickness (EOT) of 0.8 nm and a leakage current density of 1.98 x 10~(-6) A/cm~2 at 1V after post-annealing.
机译:SrTiO_3(STO)薄膜的化学共形沉积是通过ALD使用常规金属有机前体和远程等离子体活化的H_2O成功实现的。发现STO膜的ALD行为主要取决于Sr(thd)_2源的起泡温度。当Sr源鼓泡温度<〜200℃(Sr(thd)_2熔化温度)时,沉积以真正的ALD模式进行,并且化学计量的STO膜具有良好的工艺可靠性。从具有Pt顶部和Ru底部电极的平面电容器结构获得了相对良好的电性能。厚度为19.5 nm的STO膜在后退火后在1V电压下的等效氧化物厚度(EOT)为0.8 nm,漏电流密度为1.98 x 10〜(-6)A / cm〜2。

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