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High throughput grating qualification of directed self-assembly patterns using optical metrology

机译:使用光学计量的定向自组装图案的高通量光栅鉴定

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摘要

Directed self-assembly (DSA) of block copolymers (BCP) is a bottom-up patterning technique that can be used to achieve frequency multiplication of optical lithography patterns. As such, DSA could be used to provide the necessary pitch reduction for future semi-conductor manufacturing nodes. In DSA, the figure of merit for setting up and optimizing a process is not CD (critical dimension), as is done in traditional optical lithography, but rather the degree of order of the self-assembled structures that can be achieved. Top-down scanning electron microscopy (SEM) is widely used to obtain the images for the pattern quality inspection, but the data processing is labor-intensive and time-consuming. In this paper we present an optical scatterometer-based metrology technique to quantify the degree of order of line/space patterns formed by DSA, before and after the last step, in which the PMMA block is removed. In a fast and automated way, this technique assigns a grating qualification score based on the light diffracted by the DSA grating. In contrast to scatterometry, this optical technique does not require any model or reconstruction. It has the advantage of measuring at very high throughput with a large spot size, thus collecting more statistical information than with SEM. It also has fast and automated data processing capabilities. We determine the performance of the novel technique for DSA process and material optimizations and anchor the results to the SEM analysis. We obtain excellent agreement between the process windows determined with this optical technique and SEM, taking care, however, to correctly normalize the optical grating qualification score. Therefore, the optical technique is useful for a fast comparison of closely related processes, and is ideally suited for process optimizations, material selections, and monitoring purposes.
机译:嵌段共聚物(BCP)的直接自组装(DSA)是一种自底向上的图案化技术,可用于实现光学光刻图案的倍频。这样,DSA可用于为未来的半导体制造节点提供必要的间距减小。在DSA中,用于设置和优化过程的品质因数不像传统的光刻技术那样是CD(临界尺寸),而是可以实现的自组装结构的有序程度。自顶向下扫描电子显微镜(SEM)被广泛用于获取图像以进行图案质量检查,但是数据处理非常费力且费时。在本文中,我们提出了一种基于光学散射仪的计量技术,以量化在最后一步之前和之后由DSA形成的线/空间图案的有序程度,在该步骤中,去除了PMMA块。以一种快速,自动化的方式,该技术基于DSA光栅衍射的光分配光栅合格分数。与散射测量相反,这种光学技术不需要任何模型或重建。它的优点是可以以很大的光斑大小以非常高的吞吐量进行测量,因此比SEM可以收集更多的统计信息。它还具有快速和自动化的数据处理功能。我们确定用于DSA工艺和材料优化的新技术的性能,并将结果锚定到SEM分析。我们在通过这种光学技术确定的过程窗口与SEM之间取得了极好的一致性,但是要小心地正确归一化光栅的合格分数。因此,光学技术可用于快速比较紧密相关的过程,并且非常适合于过程优化,材料选择和监视目的。

著录项

  • 来源
    《Microelectronic Engineering》 |2014年第7期|175-179|共5页
  • 作者单位

    Imec vzw, Kapeldreef 75, B-3001 Leuven, Belgium;

    Imec vzw, Kapeldreef 75, B-3001 Leuven, Belgium,KULeuven, Department of Electrical Engineering (ESAT), Kasteelpark Arenberg 10, B-3001 Leuven, Belgium,Institute for Molecular Engineering, University of Chicago, 5747 South Ellis Avenue, Jones 217, Chicago, IL 60637, USA;

    Imec vzw, Kapeldreef 75, B-3001 Leuven, Belgium;

    Imec vzw, Kapeldreef 75, B-3001 Leuven, Belgium;

    Imec vzw, Kapeldreef 75, B-3001 Leuven, Belgium;

    AZ Electronic Materials, 70 Meister Avenue, Branchburg, NJ 08876, USA;

    AZ Electronic Materials, 70 Meister Avenue, Branchburg, NJ 08876, USA;

    Institute for Molecular Engineering, University of Chicago, 5747 South Ellis Avenue, Jones 217, Chicago, IL 60637, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Metrology; Directed self-assembly; Line/space patterns; Chemo-epitaxy;

    机译:计量学定向自组装;线/空间图案;化学表位;

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