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Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope

机译:三轴MEMS陀螺仪的冲击冲击可靠性和失效分析

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摘要

This paper presents the reliability assessment of a three-axis microelectromechanical systems (MEMS) gyroscope subjected to various shock loading conditions. The reliability tests include three different impact orientations and several acceleration levels of shock impact, ranging from 1500 to 15 000 g. The package failure and functional failure of the MEMS devices are studied separately. The failure analysis shows package failures of the MEMS device at a shock level above 8000 g and the functional failures of the device caused by stiction or fractures in the comb structure at a moderate shock level around 4000 g. To have a comprehensive understanding of the failure modes and predict the failure modes, dynamic finite element analyzes with direct integration are employed to investigate the nonlinear responses of the MEMS device under shock impact loadings. Internal collisions between the movable elements and the stationary parts are modeled by contact definitions. The simulation results, such as the calculated structural deformation and stress distributions, can be used to predict potential failure sites and offer explanations to the observed package failures and comb structure fractures. Furthermore, the locations of possible stiction inside the MEMS structure are also predicted by the simulation results. $hfill[2012hbox{-}0362]$
机译:本文提出了在各种冲击载荷条件下的三轴微机电系统(MEMS)陀螺仪的可靠性评估。可靠性测试包括三种不同的冲击方向和几种冲击加速度等级,范围从1500到15000 g。分别研究了MEMS器件的封装失效和功能失效。失效分析显示,在8000 g以上的冲击水平下,MEMS器件的封装失效;在4000 g左右的中等冲击水平下,由于梳状结构的粘滞或断裂引起的器件功能失效。为了全面了解失效模式并预测失效模式,采用了直接积分的动态有限元分析方法来研究MEMS器件在冲击载荷下的非线性响应。可动元件和固定部件之间的内部碰撞通过接触定义来建模。仿真结果(例如计算得出的结构变形和应力分布)可用于预测潜在的失效部位,并为观察到的包装失效和梳状结构断裂提供解释。此外,通过仿真结果还可以预测MEMS结构内部可能的静摩擦位置。 $ hfill [2012hbox {-} 0362] $

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