Chemical Removal of Solder or Solder Electroplates

摘要

The most useful solution for fast stripping of solder of solder alloy deposits is one composed of concentrated hydrochloric acid with 50 g/L MNSS. A rate of stripping as high as ～350 μm/hr is possible even at 30℃. The useful life of the solution can be increased with retention of an appreciable stripping rate by addition of antimony trioxide (2 g/L).