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Electroanalytical approaches to understand and control voiding sporadically occurring in solder joints with electroplated copper

机译：用电分析方法来了解和控制散布在具有电镀铜的焊点中的空洞

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作者
Wafula, Fred W.;
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作者单位

State University of New York at Binghamton;

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授予单位 State University of New York at Binghamton;
学科
学位 Ph.D.
年度 2011
页码 220 p.
总页数 220
原文格式 PDF
正文语种 eng
中图分类
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专利

1. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu [J] . F. WAFULA, L. YIN, P. BORGESEN, Journal of Electronic Materials . 2012,第7期

机译：聚乙二醇降解对电镀铜焊点中空洞的影响
2. Influence of Poly(ethylene glycol) Degradation on Voiding Sporadically Occurring in Solder Joints with Electroplated Cu [J] . F. Wafula, L. Yin, P. Borgesen, Journal of Electronic Materials . 2012,第7期

机译：聚乙二醇降解对电镀铜焊点中空洞的影响
3. Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface Plating in acidic copper solution with and without polyethylene glycol [J] . Y. Liu, J. Wang, L. Yin, Journal of Applied Electrochemistry . 2008,第12期

机译：电镀参数和溶液化学性质对在电镀铜-焊料界面处的空洞倾向的影响在酸性铜溶液中（有或没有聚乙二醇）电镀
4. Understanding, Controlling and Minimizing the Voiding, Sporadically Occurring in Solder Joints with Electroplated Copper [C] . F. Wafula, Y. Liu, L. Yin, Electrochemical processing in ULSI and MEMS 4 . 2009

机译：理解，控制和最小化电镀铜焊点中的空洞，零星发生
5. The vacuum hot plate soldering method to reduce voids in solder joints. [D] . Lwali, Racha. 2015

机译：真空热板焊接方法可减少焊点中的空隙。
6. Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints [O] . Jiajie Fan, Jie Wu, Changzhen Jiang, 2020

机译：随机空隙的产生以及热冲击载荷对发光二极管倒装芯片焊点机械可靠性的影响
7. Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate [O] . X. F. Zhang, J. D. Guo, J. K. Shang 2016

机译：电偶FeNi / Cu衬底在sn焊点中的电流诱导界面反应
8. Aging, stressing and solderability of electroplated and electroless copper [R] . Sorensen, N. R. , Hosking, F. M. 1995

机译：电镀和化学镀铜的老化，应力和可焊性

Electroanalytical approaches to understand and control voiding sporadically occurring in solder joints with electroplated copper

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