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SOLDER JOINTS FOR COPPER METALLIZATION HAVING REDUCED INTERFACIAL VOIDS
SOLDER JOINTS FOR COPPER METALLIZATION HAVING REDUCED INTERFACIAL VOIDS
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机译:具有减少的界面空隙的铜金属化焊点
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摘要
A metal interconnect structure ( 100 ) comprising a bond pad ( 101 ), which has copper with at least 70 volume percent composed of crystal grains expanding more than 1 mum in their main direction, and 30 or less volume percent composed of crystal grains, which expand less than 1 mum in their main crystal direction. A body ( 102 ) of tin alloy is in contact with the bond pad.
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