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Cyanide Copper Plating reinvents Itself

机译:氰化物镀铜重塑自我

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摘要

One of the outstanding properties of cyanide copper baths is excellent throwing power (TP) or metal distribution ratio, especially when compared to the acid sulfate systems. As most plating thickness specifications on parts usually do not apply to the high CD area, but to the average CD region, or more often, to a low CD area, improving the metal distribution ratio may be the best route to increasing average metal thickness. An increase in CD will decrease TP, and there may be little or no significant thickness increase in the low CD areas. Baths with higher metal concentrations are less affected in this respect. RS baths may have superior TP to that of HE baths, assuming that HE baths in use do not have brighteners and other additives in them, including Rochelle salts or proprietary equivalents, a rather rare occurrence.
机译:氰化物铜镀液的突出特性之一是出色的抛掷力(TP)或金属分布比,特别是与酸性硫酸盐体系相比。由于大多数零件上的电镀厚度规范通常不适用于高CD区域,而不适用于平均CD区域,或更常见的情况是不适用于低CD区域,因此提高金属分布比可能是增加平均金属厚度的最佳途径。 CD的增加将降低TP,低CD区域的厚度可能很少增加或没有明显增加。在这方面,金属浓度较高的镀液受到的影响较小。假设使用的HE浴液中没有增白剂和其他添加剂(包括Rochelle盐或专有等同物),则RS浴液的TP可能比HE浴液的TP高。

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