机译:碳化硅中的高温数字和模拟集成电路
Raytheon UK, Glenrothes, Fife, U.K;
Raytheon UK, Glenrothes, Fife, U.K;
Raytheon UK, Glenrothes, Fife, U.K;
Raytheon UK, Glenrothes, Fife, U.K;
Raytheon UK, Glenrothes, Fife, U.K;
Raytheon UK, Glenrothes, Fife, U.K;
Raytheon UK, Glenrothes, Fife, U.K;
Department of Electrical and Electronic Engineering, University of Strathclyde, U.K;
4H SiC; silicon carbide; CMOS; high temperature; integrated circuit; wide bandgap semiconductors; mixed signal; logic; analogue; switched capacitor;
机译:用于高温模拟集成电路(25-500 / spl deg / C)的6H碳化硅MOSFET建模
机译:先进碳化硅高温集成电路的SPICE建模
机译:高温应用中碳化硅集成电路
机译:碳化硅中的高温数字和模拟集成电路
机译:高温碳化硅中的锁相环和碳化硅集成电路的一般设计方法。
机译:用于单片三维集成电路应用的低成本和低温多晶硅纳米线传感器阵列的制造
机译:碳化硅上的高温CmOs电路