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High Temperature Digital and Analogue Integrated Circuits in Silicon Carbide

机译:碳化硅中的高温数字和模拟集成电路

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摘要

Silicon Carbide devices are capable of operating as a semiconductor at high temperatures and this capability is being exploited today in discrete power components, bringing system advantages such as reduced cooling requirements. Therefore there is an emerging need for control ICs mounted on the same modules and being capable of operating at the same temperatures. In addition, several application areas are pushing electronics to higher temperatures, particularly sensors and interface devices required for aero engines and in deep hydrocarbon and geothermal drilling. This paper discusses a developing CMOS manufacturing process using a 4H SiC substrate, which has been used to fabricate a range of simple logic and analogue circuits and is intended for power control and mixed signal sensor interface applications. Test circuits have been found to operate at up to 400℃. The introduction of a floating capacitor structure to the process allows the use of switched capacitor techniques in mixed signal circuits operating over an extended temperature range.
机译:碳化硅器件能够在高温下作为半导体工作,如今,这种功能已在分立的功率组件中得到利用,带来了诸如降低冷却要求等系统优势。因此,迫切需要安装在相同模块上并且能够在相同温度下工作的控制IC。此外,一些应用领域将电子设备推向更高的温度,特别是航空发动机以及深层碳氢化合物和地热钻探所需的传感器和接口设备。本文讨论了一种使用4H SiC基板的CMOS制造工艺,该工艺已用于制造一系列简单的逻辑和模拟电路,旨在用于功率控制和混合信号传感器接口应用。测试电路的最高工作温度为400℃。在该工艺中引入浮动电容器结构允许在扩展的温度范围内工作的混合信号电路中使用开关电容器技术。

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