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机译:使用无有机银纳米结构薄膜用于模具附着的低温烧结接头的机械性能和微观结构
Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing 100084 China;
Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing 100084 China;
Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing 100084 China;
School of Mechanical Engineering and Automation Beijiang University Beijing 100191 PR China;
Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing 100084 China;
Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing 100084 China;
Department of Mechanical Engineering State Key Laboratory of Tribology Tsinghua University Beijing 100084 China;
Silver nanostructured film; Pulsed laser deposition; die attachment; SiC chip; Sintering;
机译:在低温下由无有机Ag烧结材料烧结大型区域管芯连接
机译:低温烧结银模附着SiC功率器件组件的热机械可靠性
机译:烧结银关节冶金和力学性能对高温电源模块的模具附着可靠性的影响
机译:低温烧结银附件,用于SIC电源装置的高温操作
机译:用于制造可靠,双面冷却,高温烧结银相互连接的电源模块的机械兼容界面的设计,分析和实验验证
机译:微波烧结温度和保温时间对Si3N4 / n-SiC陶瓷力学性能和组织的影响
机译:用于电力电子模块的热机械变形烧结纳米膜模具附件的三维损伤形态