Method for sintering three-dimensional contour exhibiting semiconductor component for power electronics using low-temperature joining technique, involves applying sintering pressure by upper die with contours of semiconductor component

摘要

The method involves applying sintering pressure by an upper die (1) with contours of a semiconductor component (7) against a secondary tool (9) behind a substrate e.g. ceramic metal substrate. The upper die is pressed on thermoplastic material before a sintering process under temperature for performing thermoplastic deformation to form a negative contour on the semiconductor component. A negative contour matching the contours of the semiconductor component is obtained before performing the sintering process by a cutting process. The upper die is made of durotherm(RTM: thermoformed plastic) material and/or metal. An independent claim is also included for a contour-structured press ram for sintering a three-dimensional contour exhibiting semiconductor component.