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机译:TiO_2纳米粒子对等温时效过程中Sn-3.0Ag-0.5Cu-xTiO_2焊点中IMC生长的影响
School of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China,School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China;
School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China;
School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China;
School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China;
机译:TiO_2纳米粒子对Sn-3.0Ag-0.5Cu-xTiO_2复合焊料的热性能,润湿性和界面反应的影响
机译:纳米粒子的添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMC)的形成和生长的影响
机译:Sb对回流过程中Sn-Ag-Cu-Sb无铅焊点中IMC生长的影响
机译:等温焊接过程中IMC在Cu-Sn金属间接头中的生长动力学
机译:锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响,包括混合焊点在等温老化下的微观结构变化
机译:纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMCs)的形成和生长的影响
机译:在铜/锡 - 银 - 铜/铜焊点的形成和金属间化合物(的IMC)的生长的纳米粒子加入过程中不同的热条件的影响
机译:锡铅焊料焊接铜接头扩散层的性质和生长动力学