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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

机译：在铜/锡 - 银 - 铜/铜焊点的形成和金属间化合物（的IMC）的生长的纳米粒子加入过程中不同的热条件的影响

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Ai Ting Tan; Ai Wen Tan; Farazila Yusof;
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1. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [J] . Science and technology of advanced materials . 2015,第3期

机译：纳米粒子的添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMC）的形成和生长的影响
2. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints [J] . Rong An, Yanhong Tian, Rui Zhang, Journal of materials science . 2015,第5期

机译：电迁移诱导的金属间生长和对称Cu / Sn / Cu和Cu /金属间化合物（IMC）/ Cu接头中的空隙形成
3. Influence of Initial Morphology and Thickness of Cu_6Sn_5 and Cu_3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints [J] . X.Deng, G.Piotrowski, J.J.Williams, Journal of Electronic Materials . 2003,第12期

机译：Cu_6Sn_5和Cu_3Sn金属间化合物的初始形态和厚度对Sn-Ag焊料/ Cu接头热老化过程中生长和演变的影响
4. The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu -0.4Co eutectic solder and ENIG/Cu substrate finish [C] . Zhang Lili, Andersson Cristina, Liu Johan, Electronics Systemintegration Technology Conference . 2008

机译：回流温度和时间对SN-0.7CU -0.4CO共晶焊料与ENIG / Cu底物底漆金属间化合物（IMCs）形成和生长动力学的影响
5. Characterization and Modeling of the Failure Mechanism of Copper-Tin (Cu-Sn) Intermetallic Compounds in Lead-free Solder Joints. [D] . Yang, Chaoran. 2015

机译：无铅焊点中铜锡（Cu-Sn）金属间化合物失效机理的表征和建模。
6. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions [O] . Ai Ting Tan, Ai Wen Tan, Farazila Yusof 2015

机译：纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物（IMCs）的形成和生长的影响
7. Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints [O] . X. Deng, G. Piotrowski, J. J. Williams, 2003

机译：Cu-snO和Cu3sn金属间化合物初始形貌和厚度对sn-ag焊料/ Cu接头热老化过程中生长和演变的影响

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

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