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机译:应变速率对Sn-58Bi / Cu焊点界面断裂行为的影响
School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031, China;
School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031, China;
School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031, China;
School of Mechanical Electrical Engineering, Nanchang University, Nanchang 330031, China;
School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China;
China Electronics Technology Group Corporation No. 38 Research Institute, Hefei 230088, China;
机译:时效时间,应变率和焊锡厚度对Sn-3Cu / Cu单晶接头界面断裂行为的影响
机译:回流时间和应变速率对Sn-4Ag / Cu焊点界面断裂行为的影响
机译:微量添加铅对Sn-3.0Ag-0.5Cu / Cu和Sn-58Bi / Cu焊点的界面反应和力学性能的影响
机译:铜基体上锡-银-铜焊料接头的高应变率断裂行为
机译:底部填充和边缘结合的BGA-PCB组件的断裂:接头几何形状,应变率和刚度的影响
机译:Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
机译:界面金属间形态在Sn-Ag-Cu焊点断裂机理图中的应用