机译:回流时间和应变速率对Sn-4Ag / Cu焊点界面断裂行为的影响
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China,State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, People's Republic of China;
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China;
机译:时效时间,应变率和焊锡厚度对Sn-3Cu / Cu单晶接头界面断裂行为的影响
机译:不同时间老化的Cu / Sn-4Ag焊点断裂机理及强度影响因素
机译:应变速率对Sn-58Bi / Cu焊点界面断裂行为的影响
机译:SN3.8AG0.7CU合金的高应变速率行为及其对焊接接头断裂位置的影响。
机译:回流孔隙率对无铅焊点力学行为影响的有限元建模
机译:多重回流对Sn-0.5Cu-Al(Si)焊料和Cu基质的界面反应和力学性能的影响
机译:回流时间对saC / FeNi-Cu接头界面组织和剪切行为的影响