Structural Design of electronic package by evaluation of structural safety of solder joint based on PCB substrate strain

摘要

The present invention relates to a method for designing an electronic package structure through evaluation of structural integrity of a solder joint portion based on a substrate strain rate. More specifically, in the structural design of an electronic package, the method for designing an electronic package structure through evaluation of structural integrity of a solder joint portion based on a substrate strain rate can determine the integrity of the length of an element bonded to a substrate and a form of a solder based on the strain rate of the substrate, design an electronic package structure so that the structural integrity of an electronic package solder bonding unit can be secured in accordance with the suitability.