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机译:铜基底质地对Sn3.5Ag-Cu界面金属间化合物(IMC)生长的影响
State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China;
State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China;
Semiconductor Packaging Development, Samsung Electronics, Suwon, Korea;
State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China;
State Key Laboratory of Metal Matrix Composites, Key Laboratory for Thin Film and Microfabrication Technology of the Ministry of Education, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China;
机译:电迁移诱导的金属间生长和对称Cu / Sn / Cu和Cu /金属间化合物(IMC)/ Cu接头中的空隙形成
机译:感应加热法制备Cu / Sn / Cu夹心结构的界面Cu-Sn金属间化合物(IMCs)生长行为
机译:纳米粒子的添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMC)的形成和生长的影响
机译:回流温度和时间对SN-0.7CU -0.4CO共晶焊料与ENIG / Cu底物底漆金属间化合物(IMCs)形成和生长动力学的影响
机译:电迁移对无铅焊料V型槽样品中金属间化合物(IMC)形成的极性影响。
机译:纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMCs)的形成和生长的影响
机译:在铜/锡 - 银 - 铜/铜焊点的形成和金属间化合物(的IMC)的生长的纳米粒子加入过程中不同的热条件的影响
机译:老化后在焊料 - 基板界面上生长au-Ni-sn金属间化合物