...
机译:多次回流过程中初始Cu浓度对Sn-xCu焊料中IMC尺寸和晶粒长宽比的影响
School of Materials Science and Engineering, Dalian University of Technology;
School of Materials Science and Engineering, Dalian University of Technology;
School of Mechanical Engineering, Dalian University of Technology;
School of Materials Science and Engineering, Dalian University of Technology;
School of Materials Science and Engineering, Dalian University of Technology;
School of Materials Science and Engineering, Dalian University of Technology;
School of Materials Science and Engineering, Dalian University of Technology;
School of Materials Science and Engineering, Dalian University of Technology;
机译:Cu浓度梯度诱导的IMC生长的尺寸效应,并在多重回流过程中捕捉Ag3Sn颗粒
机译:几何轮廓进化和界面焊料泡沫和IMC在多重回流过程中的尺寸抑制相互作用
机译:多次回流过程中尺寸对Sn-xCu / Cu焊点界面反应的影响
机译:多次回流下不同Cu浓度的Sn-Cu基锡膏的组织演变
机译:高渗速率,悬浮沉积物浓度和泥沙岩堵塞沉积物粒度的影响
机译:多重回流对Sn-0.5Cu-Al(Si)焊料和Cu基质的界面反应和力学性能的影响
机译:在Sn-3.8Ag-0.7Cu和Sn-20英寸-2Ag-0.5Cu焊球栅格的回流和老化期间形成的金属间化合物在SN-3.8AG-0.7CU和SN-20IN-2AG-0.5CU焊球栅格阵列套件