Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;
Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;
Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;
Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;
Multiple Reflow; Intermetallic Compound; Microstructure Evolution;
机译:回流时间对共晶Sn-Cu焊料合金的反应性润湿,界面IMC演变和剪切强度的影响
机译:NiO纳米粒子回流焊后无铅Sn-3.0Ag-0.5Cu锡膏的组织和力学性能
机译:Fe_2NiO_4纳米颗粒添加到无铅Sn-3.0Ag-0.5Cu焊膏中对回流焊后的组织和力学性能的影响
机译:不同Cu浓度的SN-Cu基焊膏的微观结构演变对多重回流进行
机译:微合金化对Sn-Ag-Cu无铅焊料组织演变的影响。
机译:多重回流对Sn-0.5Cu-Al(Si)焊料和Cu基质的界面反应和力学性能的影响
机译:增强型Sn-Cu无铅焊料合金的微观结构形成