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Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows

机译:多次回流下不同Cu浓度的Sn-Cu基锡膏的组织演变

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摘要

The evolution in microstructure of Sn-Cu based solder paste with different copper (Cu) content subjected to multiple reflow cycles was investigated. In this study, the Sn-0.7Cu (SC) solder paste was used as based material. The Cu particles were added into SC solder paste to produce new Sn-4Cu and Sn-10Cu solder paste. After that, the solder paste was then reflowed on Cu-OSP surface finished and subjected to six times reflows. Characterization focuses on the bulk solder microstructure, morphology and intermetallic compound (IMC) thickness after multiple reflows. Results reveal that solder composition significantly affect the microstructure formation and growth of IMC.
机译:研究了不同的铜(Cu)含量的Sn-Cu基焊膏在多次回流循环下的微观结构演变。在这项研究中,Sn-0.7Cu(SC)焊膏用作基础材料。将铜颗粒添加到SC焊膏中,以生产新的Sn-4Cu和Sn-10Cu焊膏。之后,然后将焊膏在完成的Cu-OSP表面上回流并进行六次回流。表征重点在于多次回流后的块状焊料微观结构,形态和金属间化合物(IMC)厚度。结果表明,焊料成分显着影响IMC的微结构形成和生长。

著录项

  • 来源
    《Sustainable materials》|2018年|206-211|共6页
  • 会议地点 Bangkok(TH)
  • 作者单位

    Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;

    Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;

    Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;

    Center of Excellence Geopolymer Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Multiple Reflow; Intermetallic Compound; Microstructure Evolution;

    机译:多次回流;金属间化合物微观结构演变;

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