A New Solder Wetting Layer For Pb-free Solders

Chang Yul Oh; Hee-Ra Roh; Young Min Kim; Jin Soo Lee; Hae Young Cho; Young-Ho Kim

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A New Solder Wetting Layer For Pb-free Solders

机译：无铅焊料的新型焊料润湿层

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We developed a new Cu-Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn-Ag-Cu (SAC) solder interfaces was delayed. Cu_3Sn intermetallic compounds and microvoids were not observed in the SAC/Cu-Zn interfaces after aging. The drop reliability of the SAC solder/Cu-Zn joints was excellent.

机译：我们为无铅焊料开发了新的Cu-Zn润湿层。通过将Zn添加到Cu润湿层中，Sn-Ag-Cu（SAC）焊料界面中的金属间生长得以延迟。老化后，在SAC / Cu-Zn界面上未观察到Cu_3Sn金属间化合物和微孔。 SAC焊料/ Cu-Zn接头的跌落可靠性非常好。

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来源
《Journal of Materials Research》 |2009年第2期|297-300|共4页
作者
Chang Yul Oh; Hee-Ra Roh; Young Min Kim; Jin Soo Lee; Hae Young Cho; Young-Ho Kim;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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正文语种 eng
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1. Effects of Cu Contents in Pb-Free Solder Alloys on Interfacial Reactions and Bump Reliability of Pb-Free Solder Bumps on Electroless Ni-P Under-Bump Metallurgy [J] . Young-Doo Jeon, Kyung-Wook Paik, Adreas Ostmann, Journal of Electronic Materials . 2005,第1期

机译：无铅焊锡冶金中无铅焊锡合金中铜含量对界面反应和焊球可靠性的影响
2. SOLDERING CHARACTERISTICS AND THERMO- MECHANICAL PROPERTIES OF Pb-FREE SOLDER PASTE FOR REFLOW SOLDERING [J] . A.M. Najib, M.Z. Abdullah, A.A Saad, Journal of Advanced Manufacturing Technology . 2019,第2期

机译：回流焊用无铅锡膏的焊接特性和热机械性能
3. Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints [J] . R.S. Sidhu, N. Chawla Metallurgical and Materials Transactions A . 2008,第2期

机译：无铅富锡焊料合金的微观结构表征和蠕变行为：第一部分。大块焊料和焊料/铜接头的微观结构表征
4. Wetting characteristics of Pb-free solder pastes and Pb-free PWB finishes [C] . Sattiraju S.V., Dang B., Johnson R.W., Electronic Components and Technology Conference, 2001. Proceedings., 51st . 2001

机译：无铅焊膏和无铅PWB涂层的润湿特性
5. Synthesis, Formulation, and Reliability Study of Novel Pb-Free Nanocomposite Solder Pastes for Electronics Assembly and Packaging [D] . Wernicki, Evan . 2020

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6. A Computational Thermodynamics-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders [O] . Chih-han Yang, Shiqi Zhou, Shih-kang Lin, 2019

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7. Current Situation and Issues of Soldering Technology in the Pb-Free Solder Age. The Comparison of Lead-Free Solder and Sn/Pb Eutectic Solder for Mountability. [O] . Junichi INOUE 1996

机译：PB免焊期焊接技术的现状及问题。无铅焊料和Sn / Pb共晶焊料的可安装性的比较。
8. Wave soldering with Pb-free solders [R] . Artaki, I. , Finley, D. W. , Jackson, A. M. , 1995

机译：使用无铅焊料进行波峰焊

A New Solder Wetting Layer For Pb-free Solders

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