Patent Issued for Chemical Mechanical Polishing (CMP) Method for Gate Last Process

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Patent Issued for Chemical Mechanical Polishing (CMP) Method for Gate Last Process

机译：最终浇口工艺的化学机械抛光（CMP）方法已获专利

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2013 MAR 20 (VerticalNews) -- By a News Reporter-Staff News Editor at Journal of Engineering --nTaiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW) has been issued patent numbern8390072, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

机译：2013年3月20日（垂直新闻）-由《工程杂志》的新闻记者-工作人员新闻编辑-根据源自亚历山大的新闻报道，台湾半导体制造有限公司（台湾新竹）已获得专利号n8390072。，由VerticalNews编辑。

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《Journal of Engineering》 |2013年第12期|1-2|共2页
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Asia; Electronics; Taiwan Semiconductor Manufacturing Company Ltd.;

机译：亚洲;电子产品;台积电股份有限公司;

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专利

1. Design of experiment (DOE) method considering interaction effect of process parameters for optimization of copper chemical mechanical polishing (CMP) process [J] . Nam-Hoon Kim, Min-Ho Choi, Sang-Yong Kim, Microelectronic Engineering . 2006,第3期

机译：考虑工艺参数相互作用影响的实验设计（DOE）方法，用于优化铜化学机械抛光（CMP）工艺
2. Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts [J] . Toshiro K. Doi, Yasuhisa Sano, Syuhei Kurowaka, Sensors and materials . 2014,第6期

机译：基于创新理念的难加工晶体的新型化学机械抛光/等离子化学汽化加工（CMP / P-CVM）组合加工
3. Patent Issued for Chemical Mechanical Polishing Method [J] . Journal of Engineering . 2013,第12期

机译：化学机械抛光方法已获专利
4. Mechanical properties and relationship to process performance of the polishing pad in chemical mechanical polishing (CMP) of silicon [C] . Yongsik Moon, Ilwhan Park, David A. Dornfeld Topical Meeting on Silicon Machining . 1998

机译：硅化工机械抛光（CMP）抛光垫工艺性能的机械性能和关系
5. Macroscopic and microscopic modelling in chemical-mechanical polishing (CMP) process. [D] . Mao, Zhoujie. 2003

机译：化学机械抛光（CMP）过程中的宏观和微观建模。
6. Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304) [O] . Taekyoung Kim, Hyunseop Lee 2020

机译：不锈钢304（SS304）流化床化学机械抛光（FB-CMP）工艺初步研究（SS304）
7. Novel Chemical Mechanical Polishing/Plasma-Chemical Vaporization Machining (CMP/P-CVM) Combined Processing of Hard-to-Process Crystals Based on Innovative Concepts [O] . 2014

机译：基于创新概念的新型化学机械抛光/等离子体 - 化学汽化加工（CMP / P-CVM）综合加工难压晶体
8. Novel Automatic Electrochemical-mechanical Polishing (ECMP) of Metals for Scanning Electron Microscopy (Postprint). [R] . Tiley, J., Shiveley, I. K., Viswanathan, G. B., 2010

机译：用于扫描电子显微镜的金属的新型自动电化学 - 机械抛光（ECmp）（后印刷）。

Patent Issued for Chemical Mechanical Polishing (CMP) Method for Gate Last Process

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