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机译:金属间化合物的生长与无铅焊点微裂纹行为的关系
Laboratory of Advanced Electronic Packaging Technology and Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China;
Laboratory of Advanced Electronic Packaging Technology and Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China;
solder joint; intermetallic compound (IMC); microcracking behavior; finite element method; fracture;
机译:电子包装中不同基板上的Sn-Ag-Cu无铅焊点的界面反应和金属间化合物生长行为
机译:金属间化合物对原位拉伸试验中Sn3.0Ag0.5Cu无铅焊点断裂行为的影响
机译:金属间化合物对原位拉伸试验中Sn3.0Ag0.5Cu无铅焊点断裂行为的影响
机译:金属间化合物的生长对无铅焊点性能的影响
机译:无铅焊点中铜锡(Cu-Sn)金属间化合物失效机理的表征和建模。
机译:界面金属间化合物层纳米力学响应与焊点冲击可靠性的关系
机译:无铅焊点金属间化合物层形成,生长及抗剪强度评估研究