机译:封装结构对大功率发光二极管的光学和热性能的影响
Department of Avionics Systems, Nanyang Polytechnic, 180 Ang Mo Kio Avenue 8, Singapore;
School of Engineering, University of Glasgow, Glasgow, United Kingdom;
Department of Systems Power and Energy, University of Glasgow, Glasgow, United Kingdom;
School of Engineering, University of Glasgow, Glasgow, United Kingdom;
School of Engineering, University of Glasgow, Glasgow, United Kingdom;
Department of Joining Technology, Singapore Institute of Manufacturing Technology, 2 Fusionopolis Way, Singapore;
机译:通过芯片附着层的先进热设计,增强了发光二极管封装的光学性能
机译:具有集成反射器和散热器结构的发光二极管金属封装的热和光学性能
机译:高效的烟腈 - 衍生物为基于高效的有机发光二极管的非对称分子架构的热活化延迟荧光发射器
机译:大功率发光二极管封装用陶瓷基板的热阻研究
机译:发光二极管(LED)封装的热性能评估
机译:光学相干断层扫描法测定大功率InGaN基发光二极管的热膨胀系数
机译:压铸质量对高功率发光二极管包装机械和热性能的影响