Interfacial Reaction and Solder Joint Reliability of Pb-Free Solders in Lead Frame Chip Scale Packages(LF-CSP)

摘要

Chip scale packages(CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design an development of the CSP type packages. There has been an effort to eliminate Pb from solder due to its toxicology. To evaluate the various solder balls in CSP package applications, Pb- free Sn-Ag-X(X = In, Cu, Bi) and Sn-9Zn-1Bi-5 solder balls were characterized by melting behavior, phases, interfacial reaction, and solder joint reliability.