Anand本构方程在焊点可靠性研究中的应用

摘要

焊点可靠性直接决定了电子产品的使用寿命.因此,在微电子领域,对焊点可靠性提出了更高的要求.有限元模拟技术是研究焊点可靠性的重要手段.综合评述了一种统一了蠕变和塑性变形的非线性本构方程-Anand本构模型；概述了其发展演变过程及研究现状；介绍了该本构方程中9个参数的计算规则,并进一步分析了目前国内外对于本构方程参数的确定以及进一步的改进情况.在焊点可靠性研究方面,评论了该模型在无铅QFP、BGA焊点应力-应变分析及焊点疲劳寿命预测方面的应用,为焊点可靠性的研究提供了理论指导.同时,为了更好的研究无铅焊点的可靠性,对该模型的构建及修正提出了新的需求.%Service life of the electronics is decided by the reliability of solder joint .therefore,higher reliability of the solder joint is required in the field of micro-electronics.Finite Element Modeling technology is an important method to study the reliability of solder joint.Anand constitutive model which is a nonlinear equation unified with creep and plastic deformation was reviewed systematically in the text.Evolution,study status and the calculation of nine constants of this constitutive equation were introduced,and the determination of parameters and modification of the constitutive equation at home and abroad were analysed.In aspect of study of solder joint reliability .applying of the constitutive model to stress-strain analysis and fatigue life of QFP and BCA solder joint was discussed,which can provide the theory guide for practical applications.Meanwhile,new requirement for building and amending the constitutive model was proposed to study the reliability of solder joint better.