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IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

召开年：2016
召开地：Las Vegas, NV(US)
出版时间：-

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1.Mixing enhancement due to viscoelastic instability in serpentine microchannels at very large Weissenberg numbers

机译：在非常大的Weissenberg数字中蛇形微通道中的粘弹性不稳定性引起的增强
- 作者：Kevin P. Nolan;Akshat Agarwal;Shenghui Lei;Eric Dalton
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Viscosity;
- Microchannels;
- Geometry;
- Heat transfer;
- Polymers;
- Cooling;
- Solvents;
2.Thermo-mechanically and electrically induced interfacial incompatibility in 3D packages with through silicon vias

机译：通过硅通孔在3D封装中热机械和电诱导的界面不相容性
- 作者：Hanry Yang;Lutz Meinshausen;Tae-Kyu Lee;Indranath Dutta
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Through-silicon vias;
- Silicon;
- Thermal loading;
- Stress;
- Electromigration;
- Scanning electron microscopy;
3.Flow boiling of water at sub-atmospheric pressure in staggered micro pin-fin heat sink

机译：交错微针翅片散热器的亚大气压下水流沸腾
- 作者：Xuefei Han;Yogendra Joshi;Andrei Fedorov
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heat transfer;
- Temperature measurement;
- Water heating;
- Fluids;
- Heat sinks;
- Temperature distribution;
4.Boiling sensitivity analysis of asymmetrically heated micro-scale devices

机译：不对称加热微尺度器件的沸腾敏感性分析
- 作者：Fanghao Yang;Mark D. Schultz;Pritish R. Parida;Evan G. Colgan;Bing Dang;Gerard McVicker;Timothy Chainer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Temperature measurement;
- Cooling;
- Orifices;
- Resistance;
- Heat transfer;
- Vehicles;
5.Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels

机译：利用集成通道的液冷LTCC器件的设计，仿真和制造
- 作者：Tilo Welker;Jens Müller
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Coolants;
- Thermal resistance;
- Substrates;
- Electronic packaging thermal management;
- Carbon;
- Heating;
6.An advanced rack server system design For Rotational Vibration (RV) performance

机译：用于旋转振动（RV）性能的先进机架式服务器系统设计
- 作者：Xianguang Tan;Baidu Guofeng Chen;Baidu Jiajun Zhang;Baidu Chao Liu;Baidu Nishi Ahuja;Intel Jun Zhang;Intel
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Servers;
- Vibrations;
- Magnetic heads;
- System analysis and design;
- Cooling;
- Shock absorbers;
- Drives;
7.An Advanced Rack Server System Design For Rotational Vibration (RV) Performance

机译：用于旋转振动（RV）性能的先进机架式服务器系统设计
- 作者：Xianguang Tan;Guofeng Chen;Jiajun Zhang;Chao Liu;Nishi Ahuja;Jun Zhang
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
8.Disturbed and scattered: The Path of thermal conduction through diamond lattice

机译：令人不安和散落：通过金刚石晶格进行热传导的路径
- 作者：Firooz Faili;William Huang;Julian Calvo;Martin Kuball;Daniel Twitchen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Diamond;
- Thermal conductivity;
- Conductivity;
- Temperature measurement;
- Phonons;
- Conductivity measurement;
- Mathematical model;
9.Charge management for large transient loads in a multi-evaporator vapor compression system with recuperator

机译：具有恢复器的多蒸发器蒸汽压缩系统中大型瞬态负载的充电管理
- 作者：Daniel T. Pollock;Zehao Yang;John T. Wen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Valves;
- Heating;
- Liquids;
- Refrigerants;
- Mathematical model;
- Transient analysis;
10.Simultaneous Thermal/Flow Characterization of Thermal Interface Materials

机译：热敏/流量表征热界面材料
- 作者：Y. Singh;N. Bajaj;G. Subbarayan
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal Interface Material;
- Squeeze flow;
- Conductivity measurement;
11.The thermal effects of substrate removal on GaN HEMTs using Raman Thermometry

机译：使用拉曼温度法在GaN Hemts上去除衬底的热效应
- 作者：Georges Pavlidis;David Mele;Ting Cheng;Farid Medjdoub;Samuel Graham
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Temperature measurement;
- Silicon;
- Gallium nitride;
- Logic gates;
- Substrates;
- HEMTs;
- MODFETs;
12.Observations on the implementation of LEDs for general lighting

机译：关于普通照明LED实施的观察
- 作者：James R. Pryde;David. C. Whalley;Weeratunge Malalasekera
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Light emitting diodes;
- Thermal management;
- Industries;
- Arrays;
- Heat sinks;
- Lighting;
- Light sources;
13.Thermal behavior of water-copper and water-stainless steel heat pipes operating in cycles

机译：水铜和水不锈钢热管在循环中的热行为
- 作者：Débora de O. Silva;Roger R. Riehl
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- stainless steel;
- copper;
- heat exchangers;
- heat pipes;
14.Thermal conductivity of melt-processed nanofibers

机译：熔融加工纳米纤维的导热系数
- 作者：Thomas L. Bougher;Matthew K. Smith;Kyriaki Kalaitzidou;Baratunde A. Cola
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Frequency measurement;
- Thermal conductivity;
- Thermal stability;
- Polyethylene;
- Thermal management;
- Fiber lasers;
15.Thermal Management and Safety Regulation of Smart Watches

机译：智能手表的热管理和安全调节
- 作者：Angel Qian Han
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
16.Effect of removal of layers of WCSP assembly under thermal cyclic loading: A computational approach

机译：WCSP组装层在热循环载荷下除去效果：计算方法
- 作者：Trina Barua;Anik Mahmood;Karthik Rajashekar;Sayalee Sabne;A R Nazmus Sakib;Dereje Agonafer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Copper;
- Thermal expansion;
- Glass;
- Material properties;
- Strain;
- Analytical models;
- Reliability;
17.Observations on the Implementation of LEDs for General Lighting

机译：关于普通照明LED实施的观察
- 作者：James R. Pryde;Tamlite Lighting;David. C. Whalley;Weeratunge Malalasekera
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Market survey;
- Trends;
- Luminaire design;
- System integration;
- Thermal management;
18.Development and demonstration of equivalent material characteristics for microbump arrays utilized in failure estimation of chip-on-chip packaging

机译：用于芯片片上贴装故障估计的Microbump阵列的等效材料特性的开发和演示
- 作者：Chang-Chun Lee;Pei-Chen Huang;Bow-Tsin Chian
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Packaging;
- Finite element analysis;
- Strain;
- Reliability;
- Stress;
- Material properties;
19.Design, Simulation and Fabrication of Liquid Cooled LTCC Devices Utilizing Integrated Channels

机译：利用集成通道的液冷LTCC器件的设计，仿真和制造
- 作者：Tilo Welker;Jens Muller
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- LTCC;
- Liquid cooling;
- Integrated fluidic channels;
- Jet cooling;
- Thermal management;
- Packaging;
20.Disturbed and Scattered: The Path of Thermal Conduction through Diamond Lattice

机译：令人不安和散落：通过金刚石晶格进行热传导的路径
- 作者：Firooz Faili;William Huang;Julian Calvo;Martin Kuball;Daniel Twitchen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- CVD diamond;
- Thermal management;
- Thermal interface;
- Grain boundaries;
- Defect density;
- Extended defects;
- Impurities;
21.Condensation risk in a partially air side economized data center

机译：部分空气侧积聚数据中心的凝结风险
- 作者：Levente J. Klein;Fernando J. Marianno;Hendrik F. Hamman;Alan Claassen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Temperature sensors;
- Corrosion;
- Temperature distribution;
- Humidity;
- Temperature measurement;
- Air conditioning;
22.ALN thin-films as heat spreaders in III–V photonics devices Part 2: Simulations

机译：ALN薄膜作为III-V光子装置的散热器部分第2部分：模拟
- 作者：S. Lei;I. Mathews;J. Camus;S. Bensalem;M.A. Djouadi;A. Shen;G-H Duan;R. Enright
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Laser modes;
- Measurement by laser beam;
- Semiconductor lasers;
- Numerical models;
- Stress;
- Thermal resistance;
- Heating;
23.Thermal raman and IR measurement of heterogeneous integration stacks

机译：热拉曼和红外异构集成堆栈的测量
- 作者：T. Robert Harris;Georges Pavlidis;Eric J. Wyers;D. Marshal Newberry;Samuel Graham;Paul Franzon;W. Rhett Davis
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Temperature measurement;
- Gallium nitride;
- Semiconductor device measurement;
- Heating;
- HEMTs;
- MODFETs;
- Measurement by laser beam;
24.Negative impact of certain adhesive configurations on solder joint reliability of package on package architecture: A comprehensive experimental and numerical study

机译：某些粘合剂配置对包装架构包装焊接接头可靠性的负面影响：全面的实验和数值研究
- 作者：Shantanu Tripathi;Ru Han;Milena Vujosevic
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Electric shock;
- Soldering;
- Finite element analysis;
- Monitoring;
- Standards;
- Vehicles;
- Stress;
25.Thermal Performance of Nano-scale SOI and Bulk FinFETs

机译：纳米级SOI和散装FINFET的热性能
- 作者：U. Sajesh Kumar;V. Ramgopal Rao
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- FinFETs;
- Self-heating effects (SHE);
- High-k;
- Silicon on insulator (SOI);
- Thin silicon;
26.Simultaneous thermal/flow characterization of thermal interface materials

机译：热敏/流量表征热界面材料
- 作者：Y. Singh;N. Bajaj;G. Subbarayan
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Aging;
- Heating;
- Fluids;
- Thermal resistance;
- Conductivity;
- Thermal conductivity;
27.Mechanical characterization of SAC305 lead free solder at high temperatures

机译：高温SAC305无铅焊料的机械表征
- 作者：Mohammad S. Alam;Munshi Basit;Jeffrey C. Suhling;Pradeep Lall
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Strain;
- Temperature measurement;
- Temperature;
- Stress;
- Predictive models;
- Data models;
28.Vertically Aligned Carbon Nanotube Based Thermal Interface Materials for Low Contact Pressure and Low Ambient Pressure Applications

机译：基于垂直对准的碳纳米管的热界面材料，用于低接触压力和低环境压力应用
- 作者：Andrea E. Haight;Craig E. Green;Baratunde A. Cola
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
29.Negative Impact of Certain Adhesive Configurations on Solder Joint Reliability of Package on Package Architecture: A Comprehensive Experimental and Numerical Study

机译：某些粘合剂配置对包装架构包装焊接接头可靠性的负面影响：全面的实验和数值研究
- 作者：Shantanu Tripathi;Ru Han;Milena Vujosevic
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Shock;
- Temperature cycling;
- Corner glue;
- Underfill;
- Finite element analysis;
30.Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys

机译：等温老化掺杂低蠕变无铅焊膏浆料的下降冲击可靠性测试
- 作者：Sharath Sridhar;Anto Raj;Seth Gordon;Sivasubramanian Thirugnanasambandam;John L Evans;Wayne Johnson
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Lead;
- Facsimile;
- Electronic waste;
- Silver;
- Copper;
- Tin;
- Industries;
31.Performance comparison of electrowetting heat pipe for extended distance heat transport

机译：电润湿热管用于扩展距离热传输的性能比较
- 作者：Renee S. Hale;Vaibhav Bahadur
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Liquids;
- Heat transfer;
- Electrodes;
- Resistance heating;
32.Boiling Sensitivity Analysis of Asymmetrically Heated Micro-scale Devices

机译：不对称加热微尺度器件的沸腾敏感性分析
- 作者：Fanghao Yang;Mark D. Schultz;Pritish R. Parida;Evan G. Colgan;Bing Dang;Gerard McVicker;Timothy Chainer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Flow boiling;
- Sensitivity;
- Non-uniform;
- Electronics Cooling;
33.Analysis of squeeze film air damping in MEMS with lattice Boltzmann method

机译：用格子Boltzmann方法分析MEMS中的挤出薄膜空气阻尼
- 作者：Weilin Yang;Hongxia Li;TieJun Zhang;Aveek N. Chatterjee;Ibrahim M. Elfadel
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Damping;
- Force;
- Mathematical model;
- Micromechanical devices;
- Q-factor;
- Lattice Boltzmann methods;
- Oscillators;
34.The Thermal Effects of Substrate Removal on GaN HEMTs using Raman Thermometry

机译：使用拉曼温度法在GaN Hemts上去除衬底的热效应
- 作者：Georges Pavlidis;David Mele;Ting Cheng;Farid Medjdoub;Samuel Graham
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- AlGaN/GaN HEMT;
- GaN-on-Si;
- AlN;
- Raman Thermometry;
- Nanoparticles;
- TiO_2;
- ZnO;
35.Investigation of internal package structure based on the analysis of dynamic temperature response

机译：基于动态温度响应分析的内部包装结构研究
- 作者：Marcin Janicki;Tomasz Torzewicz;Andrzej Napieralski
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Cooling;
- Temperature measurement;
- Heating;
- Capacitance;
- Convection;
36.DPL Based Electro-Thermal Modelling of Fin-FET Transistors

机译：基于DPL的鳍式晶体管电热模拟
- 作者：T. Raszkowski;M. Zubert;P. Zajac;P. S. Nowak;M. Janicki;A. Samson;M. Galicia;A. Napieralski
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
37.Thermally conductive plastics for innovative thermal management solutions

机译：用于创新热管理解决方案的导热塑料
- 作者：Chandrashekar Raman;Peter Schmidt Sane
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heat sinks;
- Heat transfer;
- Plastics;
- Thermal management;
- Heating;
- Aluminum;
38.Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins

机译：具有集成微量鳍片的热点沸腾实验的热点冷却器的设计，微制造和热表征
- 作者：Xuchen Zhang;Mohamed H. Nasr;David C. Woodrum;Craig E. Green;Peter A. Kottke;Thomas E. Sarvey;Yogendra K. Joshi;Suresh K. Sitaraman;Andrei G. Fedorov;Muhannad S. Bakir
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Resistance heating;
- Cooling;
- Surface resistance;
- Fluids;
39.Model optimization of dry-out heat flux from micropillar wick structures

机译：微米灯芯结构干式热通量的模型优化
- 作者：Yangying Zhu;Zhengmao Lu;Dion S. Antao;Hongxia Li;Tiejun Zhang;Evelyn N. Wang
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Liquids;
- Mathematical model;
- Shape;
- Geometry;
40.Nanoporous membrane production via block copolymer lithography for high heat dissipation systems

机译：通过嵌段共聚物光刻生产纳米多孔膜生产用于高散热系统
- 作者：Ross Lundy;Shauna P. Flynn;Cian Cummins;Susan M. Kelleher;Maurice N. Collins;Eric Dalton;Stephen Daniels;Michael Morris;Ryan Enright
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Annealing;
- Nanostructured materials;
- Morphology;
- Solvents;
- Matrix converters;
41.Thermal management and safety regulation of smart watches

机译：智能手表的热管理和安全调节
- 作者：Angel Qian Han
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Solid modeling;
- Power demand;
- Epidermis;
- Performance evaluation;
- Smart phones;
42.Costs and benefits of thermal energy storage for augmenting indirect/direct evaporative cooling systems

机译：用于增强间接/直接蒸发冷却系统的热能储存的成本和益处
- 作者：Jeff Luttrell;Abhishek Guhe;Dereje Agonafer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Cooling;
- Thermal energy;
- Energy storage;
- Water heating;
- Humidity;
- Phase change materials;
- Media;
43.Performance Comparison of Electrowetting Heat Pipe for Extended Distance Heat Transport

机译：电润湿热管用于扩展距离热传输的性能比较
- 作者：Renee S. Hale;Vaibhav Bahadur
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Electrowetting;
- Digital microfluidics;
- Heat pipe;
- Thermal management;
44.Fabrication of compliant three-dimensional microstructures as surface coatings for dry contact thermal conductance enhancement

机译：柔顺三维微结构的制造作为干燥接触热导率的表面涂层
- 作者：Ryan Wasielewski;Jin Cui;Liang Pan;Justin A. Weibel
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Springs;
- Microstructure;
- Three-dimensional displays;
- Loading;
- Surface treatment;
- Resins;
- Thermal conductivity;
45.Nanoporous Membrane Production via Block Copolymer Lithography for High Heat Dissipation Systems

机译：通过嵌段共聚物光刻生产纳米多孔膜生产用于高散热系统
- 作者：Ross Lundy;Shauna P. Flynn;Cian Cummins;Susan M. Kelleher;Maurice N. Collins;Eric Dalton;Stephen Daniels;Michael Morris;Ryan Enright
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Block copolymer;
- Nanopatterning;
- Self-assembly;
- Membrane;
46.Model optimization of dry-out heat flux from micropillar wick structures

机译：微米灯芯结构干式热通量的模型优化
- 作者：Yangying Zhu;Zhengmao Lu;Dion S. Antao;Hongxia Li;Tiejun Zhang;Evelyn N. Wang
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Liquids;
- Mathematical model;
- Shape;
- Geometry;
47.Fundamental study on subcooled boiling of binary mixture of anti-freezing liquid toward advanced cooling technology for a SiC-based on-vehicle inverter

机译：基于SIC型逆变器的抗冰液二元混合物二元混合物脱硫沸腾的根本研究
- 作者：Tadashi Furusho;Kazuhisa Yuki;Koichi Suzuki
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Liquids;
- Heat transfer;
- Water heating;
- Cooling;
- Inverters;
- Copper;
48.Analysis of squeeze film air damping in MEMS with lattice Boltzmann method

机译：用格子Boltzmann方法分析MEMS中的挤出薄膜空气阻尼
- 作者：Weilin Yang;Hongxia Li;TieJun Zhang;Aveek N. Chatterjee;Ibrahim M. Elfadel
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Damping;
- Force;
- Mathematical model;
- Micromechanical devices;
- Q-factor;
- Lattice Boltzmann methods;
- Oscillators;
49.Thermal conductivity of melt-processed nanofibers

机译：熔融加工纳米纤维的导热系数
- 作者：Thomas L. Bougher;Matthew K. Smith;Kyriaki Kalaitzidou;Baratunde A. Cola
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Frequency measurement;
- Thermal conductivity;
- Thermal stability;
- Polyethylene;
- Thermal management;
- Fiber lasers;
50.Investigation of internal package structure based on the analysis of dynamic temperature response

机译：基于动态温度响应分析的内部包装结构研究
- 作者：Marcin Janicki;Tomasz Torzewicz;Andrzej Napieralski
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Cooling;
- Temperature measurement;
- Heating;
- Capacitance;
- Convection;
51.Test results from the comparison of three liquid cooling methods for high-power processors

机译：测试结果是高功率处理器三种液体冷却方法的比较
- 作者：Guy R. Wagner;Joseph R. Schaadt;Justin Dixon;Gary Chan;William Maltz;Kamal Mostafavi;David Copeland
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Copper;
- Temperature measurement;
- Cold plates;
- Coolants;
- Immersion cooling;
52.Flow boiling of R245fa in a microgap with integrated staggered pin fins

机译：Microgap中R245FA的流动沸腾，具有集成交错别针
- 作者：Pouya Asrar;Xuchen Zhang;Casey D. Woodrum;Craig E. Green;Peter A. Kottke;Thomas E. Sarvey;Suresh Sitaraman;Andrei Fedorov;Muhannad Bakir;Yogendra K. Joshi
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Microchannels;
- Temperature measurement;
- Temperature distribution;
- Fluids;
- Refrigerants;
- Platinum;
53.Thermal performance of nano-scale SOI and bulk FinFETs

机译：纳米级SOI和散装FINFET的热性能
- 作者：U. Sajesh Kumar;V. Ramgopal Rao
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- FinFETs;
- Thermal resistance;
- Heating;
- Substrates;
- Logic gates;
- Capacitance;
54.Negative impact of certain adhesive configurations on solder joint reliability of package on package architecture: A comprehensive experimental and numerical study

机译：某些粘合剂配置对包装架构包装焊接接头可靠性的负面影响：全面的实验和数值研究
- 作者：Shantanu Tripathi;Ru Han;Milena Vujosevic
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Electric shock;
- Soldering;
- Finite element analysis;
- Monitoring;
- Standards;
- Vehicles;
- Stress;
55.Disturbed and scattered: The Path of thermal conduction through diamond lattice

机译：令人不安和散落：通过金刚石晶格进行热传导的路径
- 作者：Firooz Faili;William Huang;Julian Calvo;Martin Kuball;Daniel Twitchen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Diamond;
- Thermal conductivity;
- Conductivity;
- Temperature measurement;
- Phonons;
- Conductivity measurement;
- Mathematical model;
56.Reduction of die-bonding interface thermal resistance for high-power LEDs through embedding packaging structure

机译：通过嵌入包装结构减少高功率LED的芯片粘接界面热阻
- 作者：Xiang Lei;Huai Zheng;Xing Guo;Sheng Liu
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Light emitting diodes;
- Substrates;
- Packaging;
- Thermal management;
- Silver;
57.Charge management for large transient loads in a multi-evaporator vapor compression system with recuperator

机译：具有恢复器的多蒸发器蒸汽压缩系统中大型瞬态负载的充电管理
- 作者：Daniel T. Pollock;Zehao Yang;John T. Wen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Valves;
- Heating;
- Liquids;
- Refrigerants;
- Mathematical model;
- Transient analysis;
58.Condensation risk in a partially air side economized data center

机译：部分空气侧积聚数据中心的凝结风险
- 作者：Levente J. Klein;Fernando J. Marianno;Hendrik F. Hamman;Alan Claassen
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Temperature sensors;
- Corrosion;
- Temperature distribution;
- Humidity;
- Temperature measurement;
- Air conditioning;
59.Development and demonstration of equivalent material characteristics for microbump arrays utilized in failure estimation of chip-on-chip packaging

机译：用于芯片片上贴装故障估计的Microbump阵列的等效材料特性的开发和演示
- 作者：Chang-Chun Lee;Pei-Chen Huang;Bow-Tsin Chian
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Packaging;
- Finite element analysis;
- Strain;
- Reliability;
- Stress;
- Material properties;
60.Vertically aligned carbon nanotube based thermal interface materials for low contact pressure and low ambient pressure applications

机译：基于垂直对准的碳纳米管的热界面材料，用于低接触压力和低环境压力应用
- 作者：Andrea E. Haight;Craig E. Green;Baratunde A. Cola
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Substrates;
- Conductivity;
- Resistance;
- Heat transfer;
- Fixtures;
- Heating;
61.Simultaneous thermal/flow characterization of thermal interface materials

机译：热敏/流量表征热界面材料
- 作者：Y. Singh;N. Bajaj;G. Subbarayan
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Aging;
- Heating;
- Fluids;
- Thermal resistance;
- Conductivity;
- Thermal conductivity;
62.Thermally conductive plastics for innovative thermal management solutions

机译：用于创新热管理解决方案的导热塑料
- 作者：Chandrashekar Raman;Peter Schmidt Sane
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heat sinks;
- Heat transfer;
- Plastics;
- Thermal management;
- Heating;
- Aluminum;
63.Thermal imaging of nanometer features

机译：纳米特征的热成像
- 作者：Kazuaki Yazawa;Dustin Kendig;Alex Shakouri;Amirkoushyar Ziabari;Ali Shakouri
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Transient analysis;
- Optical diffraction;
- Optical imaging;
- Diffraction;
64.Temperature distribution in a circular flux tube with arbitrary specified contact temperatures

机译：圆形通量管中的温度分布，具有任意指定的接触温度
- 作者：Masood Razavi;Yuri Muzychka;Serpil Kocabiyik
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Finite element analysis;
- Resistance;
- Thermal management;
- Eigenvalues and eigenfunctions;
- Films;
- Heating;
- Software packages;
65.Performance comparison of electrowetting heat pipe for extended distance heat transport

机译：电润湿热管用于扩展距离热传输的性能比较
- 作者：Renee S. Hale;Vaibhav Bahadur
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Liquids;
- Heat transfer;
- Electrodes;
- Resistance heating;
66.Boiling sensitivity analysis of asymmetrically heated micro-scale devices

机译：不对称加热微尺度器件的沸腾敏感性分析
- 作者：Fanghao Yang;Mark D. Schultz;Pritish R. Parida;Evan G. Colgan;Bing Dang;Gerard McVicker;Timothy Chainer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Temperature measurement;
- Cooling;
- Orifices;
- Resistance;
- Heat transfer;
- Vehicles;
67.Design, microfabrication and thermal characterization of a hotspot cooler testbed for convective boiling experiments in extreme-microgap with integrated micropin-fins

机译：具有集成微量鳍片的热点沸腾实验的热点冷却器的设计，微制造和热表征
- 作者：Xuchen Zhang;Mohamed H. Nasr;David C. Woodrum;Craig E. Green;Peter A. Kottke;Thomas E. Sarvey;Yogendra K. Joshi;Suresh K. Sitaraman;Andrei G. Fedorov;Muhannad S. Bakir
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Resistance heating;
- Cooling;
- Surface resistance;
- Fluids;
68.Design and testing of prototype data center

机译：原型数据中心的设计和测试
- 作者：Yogesh Fulpagare;Pratik Shirbhate;Atul Bhargav
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Servers;
- Prototypes;
- Heating;
- Mathematical model;
- Testing;
- Computational fluid dynamics;
- Atmospheric modeling;
69.Thermal management and safety regulation of smart watches

机译：智能手表的热管理和安全调节
- 作者：Angel Qian Han
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Solid modeling;
- Power demand;
- Epidermis;
- Performance evaluation;
- Smart phones;
70.Observations on the implementation of LEDs for general lighting

机译：关于普通照明LED实施的观察
- 作者：James R. Pryde;David. C. Whalley;Weeratunge Malalasekera
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Light emitting diodes;
- Thermal management;
- Industries;
- Arrays;
- Heat sinks;
- Lighting;
- Light sources;
71.Enhanced air-side performance of finned tube heat exchanger with oval obstacles for residential air-conditioning systems - numerical approach

机译：增强翅片管热交换器的空气侧性能，具有椭圆形障碍，用于住宅空调系统 - 数值方法
- 作者：Nuttawut Lewpiriyawong;Chuan Sun;Kent Loong Khoo;Poh Seng Lee;Siaw Kiang Chou
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Electron tubes;
- Heat transfer;
- Mathematical model;
- Heating;
- Kinetic energy;
- Refrigerants;
- Viscosity;
72.Nanoporous membrane production via block copolymer lithography for high heat dissipation systems

机译：通过嵌段共聚物光刻生产纳米多孔膜生产用于高散热系统
- 作者：Ross Lundy;Shauna P. Flynn;Cian Cummins;Susan M. Kelleher;Maurice N. Collins;Eric Dalton;Stephen Daniels;Michael Morris;Ryan Enright
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Annealing;
- Nanostructured materials;
- Morphology;
- Solvents;
- Matrix converters;
73.Mechanical characterization of SAC305 lead free solder at high temperatures

机译：高温SAC305无铅焊料的机械表征
- 作者：Mohammad S. Alam;Munshi Basit;Jeffrey C. Suhling;Pradeep Lall
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Strain;
- Temperature measurement;
- Temperature;
- Stress;
- Predictive models;
- Data models;
74.Flow boiling of water at sub-atmospheric pressure in staggered micro pin-fin heat sink

机译：交错微针翅片散热器的亚大气压下水流沸腾
- 作者：Xuefei Han;Yogendra Joshi;Andrei Fedorov
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heat transfer;
- Temperature measurement;
- Water heating;
- Fluids;
- Heat sinks;
- Temperature distribution;
75.Fabrication of compliant three-dimensional microstructures as surface coatings for dry contact thermal conductance enhancement

机译：柔顺三维微结构的制造作为干燥接触热导率的表面涂层
- 作者：Ryan Wasielewski;Jin Cui;Liang Pan;Justin A. Weibel
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Springs;
- Microstructure;
- Three-dimensional displays;
- Loading;
- Surface treatment;
- Resins;
- Thermal conductivity;
76.Kinetic Cooling for thermal management of high power electronics

机译：高功率电子热管理动力学冷却
- 作者：Lino Gonzalez;Ben Kessel;Jiyue Zhang
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heat transfer;
- Heat sinks;
- Kinetic theory;
- Heating;
- Resistance;
- Heat engines;
77.An advanced rack server system design For Rotational Vibration (RV) performance

机译：用于旋转振动（RV）性能的先进机架式服务器系统设计
- 作者：Xianguang Tan;Baidu Guofeng Chen;Baidu Jiajun Zhang;Baidu Chao Liu;Baidu Nishi Ahuja;Intel Jun Zhang;Intel
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Servers;
- Vibrations;
- Magnetic heads;
- System analysis and design;
- Cooling;
- Shock absorbers;
- Drives;
78.Thermal property investigation of multi walled carbon nanotubes (MWCNTs) embedded Phase Change Materials (PCMs)

机译：多壁碳纳米管（MWCNT）嵌入相变材料（PCMS）的热性能研究
- 作者：Murat Parlak;?engül Kurtulu?;ümit Nazl? Temel;Kerim Yapici
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Phase change materials;
- Thermal conductivity;
- Temperature measurement;
- Conductivity;
- Temperature;
- Heating;
- Thermal loading;
79.Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys

机译：等温老化掺杂低蠕变无铅焊膏浆料的下降冲击可靠性测试
- 作者：Sharath Sridhar;Anto Raj;Seth Gordon;Sivasubramanian Thirugnanasambandam;John L Evans;Wayne Johnson
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Lead;
- Facsimile;
- Electronic waste;
- Silver;
- Copper;
- Tin;
- Industries;
80.Direct bonding of a titanium header to an embedded two-phase FEEDS cooling device for high-flux electronics

机译：用于高通量电子器件的钛头部直接粘合到嵌入式两相供给冷却装置
- 作者：David C. Deisenroth;Raphael K. Mandel;Hannes Greve;Serguei V. Dessiatoun;Patrick McCluskey;Michael M. Ohadi
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Silicon;
- Manifolds;
- Heating;
- Thermal management;
- Fluids;
- Nickel;
- Electric potential;
81.DPL based electro-thermal modelling of Fin-FET transistors

机译：基于DPL的鳍式晶体管电热模拟
- 作者：T. Raszkowski;M. Zubert;P. Zaj?c;P. S. Nowak;M. Janicki;A. Samson;M. Galicia;A. Napieralski
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Inverters;
- CMOS integrated circuits;
- Integrated circuit modeling;
- Transistors;
- Heating;
- Modems;
- Thermal loading;
82.Minimization of residual stress in TSV interconnections by controlling their crystallinity

机译：通过控制结晶度最小化TSV互连中的残余应力
- 作者：Jiatong Liu;Takeru Kato;Ken Suzuki;Hideo Miura
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Copper;
- Annealing;
- Films;
- Current density;
- Young's modulus;
- Residual stresses;
- Silicon;
83.Effect of removal of layers of WCSP assembly under thermal cyclic loading: A computational approach

机译：WCSP组装层在热循环载荷下除去效果：计算方法
- 作者：Trina Barua;Anik Mahmood;Karthik Rajashekar;Sayalee Sabne;A R Nazmus Sakib;Dereje Agonafer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Copper;
- Thermal expansion;
- Glass;
- Material properties;
- Strain;
- Analytical models;
- Reliability;
84.ALN thin-films as heat spreaders in III–V photonics devices Part 2: Simulations

机译：ALN薄膜作为III-V光子装置的散热器部分第2部分：模拟
- 作者：S. Lei;I. Mathews;J. Camus;S. Bensalem;M.A. Djouadi;A. Shen;G-H Duan;R. Enright
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Laser modes;
- Measurement by laser beam;
- Semiconductor lasers;
- Numerical models;
- Stress;
- Thermal resistance;
- Heating;
85.Mixing enhancement due to viscoelastic instability in serpentine microchannels at very large Weissenberg numbers

机译：在非常大的Weissenberg数字中蛇形微通道中的粘弹性不稳定性引起的增强
- 作者：Kevin P. Nolan;Akshat Agarwal;Shenghui Lei;Eric Dalton
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Viscosity;
- Microchannels;
- Geometry;
- Heat transfer;
- Polymers;
- Cooling;
- Solvents;
86.Reliability assessment of hydrofoil-shaped micro-pin fins

机译：水翼形微销翅片的可靠性评估
- 作者：David C. Woodrum;Xuchen Zhang;Peter A. Kottke;Yogendra K. Joshi;Andrei G. Fedorov;Muhannad S. Bakir;Suresh K. Sitaraman
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Stress;
- Fluids;
- Pins;
- Geometry;
- Heating;
- Microchannels;
- Silicon;
87.The thermal effects of substrate removal on GaN HEMTs using Raman Thermometry

机译：使用拉曼温度法在GaN Hemts上去除衬底的热效应
- 作者：Georges Pavlidis;David Mele;Ting Cheng;Farid Medjdoub;Samuel Graham
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Temperature measurement;
- Silicon;
- Gallium nitride;
- Logic gates;
- Substrates;
- HEMTs;
- MODFETs;
88.Capillary flow characteristics of a novel micropillar array for applications in capillary-driven two-phase cooling systems

机译：用于毛细管驱动的两相冷却系统中的新型微生物阵列的毛细管流动特性
- 作者：Ashley Byers;Jeff Darabi
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heating;
- Liquids;
- Geometry;
- Mathematical model;
- Permeability;
- Cooling;
89.Thermo-mechanically and electrically induced interfacial incompatibility in 3D packages with through silicon vias

机译：通过硅通孔在3D封装中热机械和电诱导的界面不相容性
- 作者：Hanry Yang;Lutz Meinshausen;Tae-Kyu Lee;Indranath Dutta
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Through-silicon vias;
- Silicon;
- Thermal loading;
- Stress;
- Electromigration;
- Scanning electron microscopy;
90.Thermal-mechanical considerations during thermal solution assembly of bare-die packages

机译：裸模包装热溶液组装期间的热机械考虑
- 作者：Je-Young Chang;Tannaz Harirchian;Shubhada Sahasrabudhe;Steve Klein;Frank Liang;Haowen Liu;Moss Weng;Mark Gallina;Marco A. Cartas-Ayala;Radha Muddu;Ashish Gupta
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Cold plates;
- Thermal loading;
- Electronic packaging thermal management;
- Pressure measurement;
- Mobile communication;
- Heating;
- Computers;
91.Costs and benefits of thermal energy storage for augmenting indirect/direct evaporative cooling systems

机译：用于增强间接/直接蒸发冷却系统的热能储存的成本和益处
- 作者：Jeff Luttrell;Abhishek Guhe;Dereje Agonafer
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Cooling;
- Thermal energy;
- Energy storage;
- Water heating;
- Humidity;
- Phase change materials;
- Media;
92.Thermal raman and IR measurement of heterogeneous integration stacks

机译：热拉曼和红外异构集成堆栈的测量
- 作者：T. Robert Harris;Georges Pavlidis;Eric J. Wyers;D. Marshal Newberry;Samuel Graham;Paul Franzon;W. Rhett Davis
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Temperature measurement;
- Gallium nitride;
- Semiconductor device measurement;
- Heating;
- HEMTs;
- MODFETs;
- Measurement by laser beam;
93.Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels

机译：利用集成通道的液冷LTCC器件的设计，仿真和制造
- 作者：Tilo Welker;Jens Müller
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Coolants;
- Thermal resistance;
- Substrates;
- Electronic packaging thermal management;
- Carbon;
- Heating;
94.Thermal behavior of water-copper and water-stainless steel heat pipes operating in cycles

机译：水铜和水不锈钢热管在循环中的热行为
- 作者：Débora de O. Silva;Roger R. Riehl
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- stainless steel;
- copper;
- heat exchangers;
- heat pipes;
95.Thermal imaging of nanometer features

机译：纳米特征的热成像
- 作者：Kazuaki Yazawa;Dustin Kendig;Alex Shakouri;Amirkoushyar Ziabari;Ali Shakouri
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Thermal resistance;
- Transient analysis;
- Optical diffraction;
- Optical imaging;
- Diffraction;
96.Kinetic Cooling for thermal management of high power electronics

机译：高功率电子热管理动力学冷却
- 作者：Lino Gonzalez;Ben Kessel;Jiyue Zhang
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Heat transfer;
- Heat sinks;
- Kinetic theory;
- Heating;
- Resistance;
- Heat engines;
97.Direct bonding of a titanium header to an embedded two-phase FEEDS cooling device for high-flux electronics

机译：用于高通量电子器件的钛头部直接粘合到嵌入式两相供给冷却装置
- 作者：David C. Deisenroth;Raphael K. Mandel;Hannes Greve;Serguei V. Dessiatoun;Patrick McCluskey;Michael M. Ohadi
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Silicon;
- Manifolds;
- Heating;
- Thermal management;
- Fluids;
- Nickel;
- Electric potential;
98.Thermal performance of nano-scale SOI and bulk FinFETs

机译：纳米级SOI和散装FINFET的热性能
- 作者：U. Sajesh Kumar;V. Ramgopal Rao
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- FinFETs;
- Thermal resistance;
- Heating;
- Substrates;
- Logic gates;
- Capacitance;
99.Reliability assessment of hydrofoil-shaped micro-pin fins

机译：水翼形微销翅片的可靠性评估
- 作者：David C. Woodrum;Xuchen Zhang;Peter A. Kottke;Yogendra K. Joshi;Andrei G. Fedorov;Muhannad S. Bakir;Suresh K. Sitaraman
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Stress;
- Fluids;
- Pins;
- Geometry;
- Heating;
- Microchannels;
- Silicon;
100.ALN Thin-films as Heat Spreaders in III-V Photonics Devices Part 2: Simulations

机译：ALN薄膜作为III-V光子装置的散热器部分第2部分：模拟
- 作者：S. Lei;I. Mathews;J. Camus;S. Bensalem;M. A. Djouadi;A. Shen;G-H Duan;R. Enright
- 会议名称：《IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems》 | 2016年
- Photonics devices;
- ALN thin-film;
- Heat spreader;
- Numerical simulations;