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Device-Circuit Interaction and Performance Benchmarking of Tunnel Transistor-Based Ex-OR Gates for Energy Efficient Computing

机译:基于隧道晶体管的隧道晶体管的沟槽的装置电路交互和性能基准,用于节能计算

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This paper explores the design and analysis of 20nm tunnel transistor-based Exclusive-OR (Ex-OR) gates and half-adder cells with circuit interaction (co-design) approach for energy efficient and reliable computing architectures at scaled supply voltages (50-300mV). TFETs have attracted much attention recently for energy efficient system designs. The circuit interaction is made possible for designing more consistent functional architectures at the minimum power supply of 50-300mV. Using this technique, the core computational blocks of basic adder blocks and Ex-OR gates are designed with TFET as a fundamental device and the whole design procedure is elaborated in this paper. The primary classifications of Tunnel FETs, viz. Homo-junction TFET (HoJn TFET) and Hetero-junction TFETs (HeJn TFET) are investigated thoroughly under different constraints specifically at the device configurations. By considering the above-mentioned subtypes of TFETs, three variants of Ex-OR primitive gates are modeled and are named with respect to the use of transistors as static complementary TFET-12T (SC12T), Transmission Gate logic-8T (TG8T) and Improved Transmission Gate logic-6T (ITG6T) Ex-OR gate designs. The benchmarking of the proposed gates is done using double-gate Si FinFET at 20nm technology. Amongst all the three proposed Ex-OR designs of SC12T, TG8T and ITG6T in addition to that of LVT and HVT FinFET/CMOS, only ITG6T is the designer's choice by offering the minimum power consumption as well as high energy, improved choice compared to the other two styles of designs and also when robustness and reliability are taken into account, SC12T and TG8T designs are not providing the full swing of outputs. The minute glitch with that of ITG6T designs is a lesser reliability feature and for this the best alternative is TFET TG8T by providing suppressed over shoots and enhanced transition speed. From the performed multi simulations under different critical conditions and at supply voltage of 100mV, it is being demonstrated that the energy efficient circuit option is the SC12T and ITG6T Ex-OR designs which are validated with the steep slope characteristics of TFET's and also these two designs offer reliability advantage. The major restrictions from the energy efficiency issues are eliminated and disclosed in the HoJn TFETs and HeJn TFET by using circuit co-design methodology and TFETs steep slope characteristics.
机译:本文探讨了20nm隧道晶体管的专用或(前或)门和半加法电池的设计和分析,具有电路交互(共设计)方法,用于在缩放电源电压下节能且可靠的计算架构(50- 300mv)。 TFET最近引起了很多关注的节能系统设计。电路交互可以在50-300mV的最小电源下设计更一致的功能架构。使用该技术,基本加法器块和栅栏的核心计算块与TFET设计为基本装置,本文详细阐述了整个设计过程。隧道FET,VIZ的主要分类。在特定于装置配置的不同约束下,在不同的限制下彻底研究了同源结TFET(HOJN TFET)和异质结TFET(HEJN TFET)。通过考虑上述TFET的亚型,采用了三种外栅的三个变体,并由晶体管作为静态互补TFET-12T(SC12T),传输门逻辑-8T(TG8T)的使用命名,并提高传输门逻辑-6T(ITG6T)出口或门设计。拟议门的基准在20nm技术下使用双栅Si FinFET完成。在所有三个提议的SC12T,TG8T和ITG6T的外部或设计之外除了LVT和HVT FinFET / CMOS之外,只有ITG6T是设计师的选择,通过提供最小的功耗以及高能量,改善的选择与...相比其他两种风格的设计以及考虑鲁棒性和可靠性时,SC12T和TG8T设计并不提供输出的全面摆动。具有ITG6T设计的微小的毛刺是一种较小的可靠性特征,并且对于这种最佳替代方案是TFET TG8T通过提供抑制拍摄和增强的过渡速度。从在不同的临界条件下的执行多模拟和100mV的电源电压下,据证明了节能电路选项是SC12T和ITG6T的EX-OR或设计,其验证了TFET的陡坡特性以及这两种设计提供可靠性优势。通过使用电路共同设计方法和TFET陡坡特性,在Hojn TFET和Hejn TFET中消除和公开了能量效率问题的主要限制。

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