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Tunnel Transistor-Based Reliable and Energy Efficient Computing Architectures with Circuit and Architectural Co-Design at Low VDD

机译:低电压下基于隧道晶体管的可靠节能计算架构,具有电路和架构协同设计

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Tunnel field-effect transistors (TFETs) as low voltage device options have attracted recent attention for energy efficient circuit designs with CMOS technology scaling. This paper presents the circuit and architectural co-design approach for designing reliable and energy efficient architectures (adder cells) for new computing platforms at supply voltages. At circuit level TFET-based 28-transistor static logic design (28T) and 24-transistor transmission gate logic design (24T) have been explored. At architectural level, multiplexer (MUX)-based 22-transistor full adder design (22T) is proposed. Performance of TFET-based architectures have also been benchmarked with 20nm double gate Si FinFET technology. It has been seen that with FinFET technology 24T design is not effective in terms of energy efficiency and reliability (due to the large leakage currents in transmission gate logic topology). 28T design is the best in reliability perspective (in terms of reduced over shoots, full logic swing and reduced glitch duration etc.) and 22T design to be energy efficient option. It has been demonstrated in this paper that TFET's steep slope characteristics enable the 24T design to have similar reliability characteristics like 28T design and energy efficiency like 22T design. TFET-based 22T design has similar to 91% smaller energy delay product (EDP) and similar to 84.4% less power delay product (PDP) in comparison to the low threshold voltage (LVT) FinFET 22T design at 0.2V V-DD.
机译:隧道场效应晶体管(TFET)作为低压器件的选择已引起了人们对采用CMOS技术缩放的节能电路设计的最新关注。本文介绍了在电源电压下为新计算平台设计可靠且节能的架构(加法器单元)的电路和架构协同设计方法。在电路级,已经研究了基于TFET的28晶体管静态逻辑设计(28T)和24晶体管传输门逻辑设计(24T)。在体系结构级别,提出了基于多路复用器(MUX)的22晶体管全加法器设计(22T)。基于TFET的架构的性能也已经通过20nm双栅极Si FinFET技术进行了基准测试。可以看出,采用FinFET技术时,由于能效和可靠性方面的24T设计是无效的(由于传输门逻辑拓扑中的漏电流很大)。从可靠性角度来看,28T设计是最好的(从减少超标,完整的逻辑摆幅和减少的毛刺持续时间等方面),而22T设计是节能的选择。本文已证明,TFET的陡峭斜率特性使24T设计具有类似的可靠性特性(如28T设计)和能效(如22T设计)。与0.2V V-DD的低阈值电压(LVT)FinFET 22T设计相比,基于TFET的22T设计的能量延迟积(EDP)减小了91%,功率延迟积(PDP)减小了84.4%。

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