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Circuit and Architectural Co-design for Reliable Adder Cells with Steep Slope Tunnel Transistors for Energy Efficient Computing

机译:带有陡坡隧道晶体管的可靠加法器单元的电路和架构协同设计,可实现节能计算

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Tunnel FETs (TFETs) as steep slope devices have attracted much attention for designing energy efficient digital systems at scaled supply voltages. In this paper, we propose a circuit/architectural co-design approach for designing reliable and energy efficient adder cells for new computing platforms at supply voltages as low as 0.1V. At circuit level, widely used XOR gates such as 6T and 8T designs are explored and at the architectural level, adder cells with static CMOS like design (28T), tarnsmission gate design (24T), XOR based design (22T and 18T), and MUX based design (MBFA-22T) have been considered. The performance of all TFET designs have been benchmarked with 20nm double gate Si Fin FET technology. TFET designs have lower energy and energy delay product (EDP) due to TFET's steep sub threshold slope characteristics at 0.1V. 18T design is more energy efficient with slight trade-off in logic swing (i.e., robustness) and 22T and 28T designs are more robust and optimal energy efficient options.
机译:作为斜率器件的隧道FET(TFET)在按比例缩放的电源电压下设计节能数字系统引起了广泛的关注。在本文中,我们提出了一种电路/架构协同设计方法,用于在低至0.1V的电源电压下为新的计算平台设计可靠且节能的加法器单元。在电路层级,探索了广泛使用的XOR门,例如6T和8T设计;在体系结构级,具有静态CMOS的加法器单元(如28T),靶发射门设计(24T),基于XOR的设计(22T和18T),以及已经考虑了基于MUX的设计(MBFA-22T)。所有TFET设计的性能均已通过20nm双栅极Si Fin FET技术进行了基准测试。由于TFET在0.1V时具有陡峭的亚阈值斜率特性,因此TFET设计具有较低的能量和能量延迟乘积(EDP)。 18T设计具有更高的能源效率,但在逻辑摆幅(即鲁棒性)方面略有权衡,而22T和28T设计则具有更高的坚固性和最佳的节能选择。

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