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Circuit and Architectural Co-design for Reliable Adder Cells with Steep Slope Tunnel Transistors for Energy Efficient Computing

机译:具有陡坡隧道晶体管的可靠加法细胞的电路和架构共设计,用于节能计算

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Tunnel FETs (TFETs) as steep slope devices have attracted much attention for designing energy efficient digital systems at scaled supply voltages. In this paper, we propose a circuit/architectural co-design approach for designing reliable and energy efficient adder cells for new computing platforms at supply voltages as low as 0.1V. At circuit level, widely used XOR gates such as 6T and 8T designs are explored and at the architectural level, adder cells with static CMOS like design (28T), tarnsmission gate design (24T), XOR based design (22T and 18T), and MUX based design (MBFA-22T) have been considered. The performance of all TFET designs have been benchmarked with 20nm double gate Si Fin FET technology. TFET designs have lower energy and energy delay product (EDP) due to TFET's steep sub threshold slope characteristics at 0.1V. 18T design is more energy efficient with slight trade-off in logic swing (i.e., robustness) and 22T and 28T designs are more robust and optimal energy efficient options.
机译:隧道FET(TFET)作为陡坡装置引起了在缩放电源电压下设计节能数字系统的许多关注。在本文中,我们提出了一种电路/架构共解设计方法,用于在电源电压下为新的计算平台设计可靠和节能的加法器单元,低至0.1V。在电路电平,广泛使用的XOR门等XOR门槛如6T和8T设计,并在建筑级别,具有静态CMOS的加法器单元,如设计(28T),塔尔斯密栅极设计(24T),基于XOR基于XOR的设计(22T和18T),已考虑基于MUX的设计(MBFA-22T)。所有TFET设计的性能都以20nm双栅Si Fin FET技术为基准测试。由于TFET的陡峭亚阈值斜率特性为0.1V,TFET设计具有较低的能量和能量延迟产品(EDP)。 18T设计在逻辑挥杆(即,鲁棒性)和22T和28T的设计中具有轻微的折衷更易于折衷更加强大,最佳的节能选择。

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