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Evolution of 1 / f~α noise during electromigration stressing of metal film: Spectral signature of electromigration process

机译:金属膜电迁移应力过程中1 / f〜α噪声的演变:电迁移过程的光谱特征

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摘要

In this paper we report a systematic study of low-frequency 1 / f~α resistance fluctuation in a metal film at different stages of electromigration. The resistance fluctuation (noise) measurement was carried out in presence of a dc electromigration stressing current. We observe that in addition to the increase in the spectral power S_V(f), the frequency dependence of the spectral power changes as the electromigration process progresses and the exponent a starts to change from 1 to higher value closer to 1.5. We interpret this change in a as arising due to an additional contribution to the spectral power with a 1/f~(3/2) component, which starts to contribute as the electromigration process progresses. This additional component S_V(f) ~ 1 / f~(3/2) has been suggested to originate from long range diffusion that would accompany any electromigration process. The experimental observation finds support in a model simulation, where we also find that the enhancement of noise during electromigration stressing is accompanied by a change in spectral power frequency dependence.
机译:在本文中,我们报告了对金属膜在电迁移不同阶段的低频1 / f〜α电阻波动的系统研究。在直流电迁移应力电流的存在下进行电阻波动(噪声)测量。我们观察到,除了谱功率S_V(f)的增加外,谱功率的频率依赖性还随电迁移过程的进行而变化,指数a开始从1变为更高的值,接近1.5。我们将这种变化解释为是由于对具有1 / f〜(3/2)分量的光谱功率的额外贡献而引起的,随着电迁移过程的进行,它开始起作用。已建议该附加分量S_V(f)〜1 / f〜(3/2)来自任何电迁移过程都会伴随的长距离扩散。实验观察为模型仿真提供了支持,在模型仿真中,我们还发现电迁移应力期间噪声的增强伴随着频谱功率频率依赖性的变化。

著录项

  • 来源
    《Journal of Applied Physics》 |2006年第11期|p.113701.1-113701.7|共7页
  • 作者单位

    Department of Physics, Indian Institute of Science, Bangalore 560 012, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 应用物理学;计量学;
  • 关键词

  • 入库时间 2022-08-18 03:12:45

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