首页> 外文期刊>Journal of Applied Physics >Growth and characterization of AIGaN/GaN/AIGaN double-heterojunction high-electron-mobility transistors on 100-mm Si(111) using ammonia-molecular beam epitaxy
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Growth and characterization of AIGaN/GaN/AIGaN double-heterojunction high-electron-mobility transistors on 100-mm Si(111) using ammonia-molecular beam epitaxy

机译:使用氨分子束外延在100-mm Si(111)上生长和表征AIGaN / GaN / AIGaN双异质结高电子迁移率晶体管

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摘要

To improve the confinement of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) heterostructures, AlGaN/GaN/AlGaN double heterojunction HEMT (DH-HEMT) heterostructures were grown using ammonia-MBE on 100-mm Si substrate. Prior to the growth, single heterojunction HEMT (SH-HEMT) and DH-HEMT heterostructures were simulated using Poisson-Schrodinger equations. From simulations, an AlGaN buffer with "Al" mole fraction of 10% in the DH-HEMT was identified to result in both higher 2DEG concentration (~10~(13)cm~(-2)) and improved 2DEG confinement in the channel. Hence, this composition was considered for the growth of the buffer in the DH-HEMT heterostructure. Hall measurements showed a room temperature 2DEG mobility of 1510cm~2/V.s and a sheet carrier concentration (n_s) of 0.97 × 10~(13)cm~(-2) for the DH-HEMT structure, while they are 1310cm~2/V.s and 1.09 × 10~(13)cm~(-2), respectively, for the SH-HEMT. Capacitance-voltage measurements confirmed the improvement in the confinement of 2DEG in the DH-HEMT heterostructure, which helped in the enhancement of its room temperature mobility. DH-HEMT showed 3 times higher buffer break-down voltage compared to SH-HEMT, while both devices showed almost similar drain current density. Small signal RF measurements on the DH-HEMT showed a unity current-gain cut-off frequency (f_T) and maximum oscillation frequency (f_(max)) of 22 and 25 GHz, respectively. Thus, overall, DH-HEMT heterostructure was found to be advantageous due to its higher buffer break-down voltages compared to SH-HEMT heterostructure.
机译:为了改善AlGaN / GaN高电子迁移率晶体管(HEMT)异质结构中的二维电子气(2DEG)的局限性,使用氨膜MBE在100 mm上生长了AlGaN / GaN / AlGaN双异质结HEMT(DH-HEMT)异质结构。硅衬底。在生长之前,使用泊松-薛定inger方程模拟单异质结HEMT(SH-HEMT)和DH-HEMT异质结构。通过模拟,确定了DH-HEMT中“ Al”摩尔分数为10%的AlGaN缓冲液可导致较高的2DEG浓度(〜10〜(13)cm〜(-2))和改善的通道中2DEG限制。因此,考虑该组合物用于DH-HEMT异质结构中缓冲液的生长。霍尔测量结果表明,DH-HEMT结构的室温2DEG迁移率为1510cm〜2 / Vs,薄层载流子浓度(n_s)为0.97×10〜(13)cm〜(-2),而其为1310cm〜2 / SH-HEMT的Vs和1.09×10〜(13)cm〜(-2)。电容电压测量结果证实了DH-HEMT异质结构中2DEG限制的改善,这有助于提高其室温迁移率。 DH-HEMT的缓冲器击穿电压是SH-HEMT的3倍,而两种器件的漏极电流密度几乎相同。在DH-HEMT上进行的小信号RF测量显示分别为22 GHz和25 GHz的单位电流增益截止频率(f_T)和最大振荡频率(f_(max))。因此,总的来说,发现DH-HEMT异质结构是有利的,因为与SH-HEMT异质结构相比,DH-HEMT异质结构具有更高的缓冲击穿电压。

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  • 来源
    《Journal of Applied Physics》 |2015年第2期|025301.1-025301.7|共7页
  • 作者单位

    NOVITAS-Nanoelectronics Centre of Excellence, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798;

    Temasek Laboratories@NTU, Nanyang Technological University, Singapore 637553;

    NOVITAS-Nanoelectronics Centre of Excellence, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798;

    Temasek Laboratories@NTU, Nanyang Technological University, Singapore 637553;

    NOVITAS-Nanoelectronics Centre of Excellence, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798;

    Temasek Laboratories@NTU, Nanyang Technological University, Singapore 637553;

    Temasek Laboratories@NTU, Nanyang Technological University, Singapore 637553;

    NOVITAS-Nanoelectronics Centre of Excellence, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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