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Plasma assisted molecular beam epitaxy of AIGaN/GaN high electron mobility transistors

机译:AIGAN / GaN高电子迁移晶体管的等离子体辅助分子束外延

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We report on the plasma-assisted molecular beam epitaxy (PAMBE) of A1GaN/GaN high electron mobility transistors (HEMTS). Growth was performed on MOCVD grown GaN Templates and 4H-SiC(0001) wafers with 3" diameter. In a detailed study of GaN growth conditions the growth rate was varied between 0.28 and 0.5 μm/h. Under optimized condi-tions, the surface root mean square roughness was less than 0.6 nm. Low temperature PL measurements in the range 1.9 to 3.8 eV showed only the exciton-emission with a FWHM of 12 meV. AIGaN-HEMT structures on GaN-templates exhibited room temperature Hall mobilities of 1600 cm~2Ns and sheet electron concentration of 8 x 10~(12) /cm~2. On SiC mobilities of 1220 cm~2Ns were achieved. Current-voltage output characteristics of PAMBE grown AIGaN/GaN HEMTs on SiC showed a drain current density about 0.8 A/mm for a gate bias of +1V and only small dispersion.
机译:我们报告A1GaN / GaN高电子迁移率晶体管(HEMT)的等离子体辅助分子束外延(PAMBE)。在MOCVD生长的GaN模板和3“直径的4H-SiC(0001)晶片上进行生长。在GaN生长条件的详细研究中,生长速率在0.28和0.5μm/ h之间变化。在优化的条件下,表面根均方粗糙度小于0.6nm。1.9至3.8 em范围内的低温PL测量只有12 MeV的FWHM显示出的激子排放。GaN模板上的Aigan-HEMT结构表现出1600厘米的室温霍尔职业〜2ns和片材电子浓度为8×10〜(12)/ cm〜2。达到1220cm〜2ns的SiC迁移率。Pambe种植Aigan / GaN Hemts的电流 - 电压输出特性SiC显示出漏极电流密度对于+ 1V的栅极偏压,0.8 A / mm,并且仅小分散。

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