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Band structure of germanium carbides for direct bandgap silicon photonics

机译:直接带隙硅光子学中碳化锗的能带结构

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摘要

Compact optical interconnects require efficient lasers and modulators compatible with silicon. Ab initio modeling of Ge_(1-x)C_x (x = 0.78%) using density functional theory with HSE06 hybrid functional predicts a splitting of the conduction band at Γ and a strongly direct bandgap, consistent with band anticrossing. Photoreflectance of Ge_(0.998)C_(0.002) shows a bandgap reduction supporting these results. Growth of Ge_(0.998)C_(0.002) using tetrakis(germyl)methane as the C source shows no signs of C-C bonds, C clusters, or extended defects, suggesting highly substitutional incorporation of C. Optical gain and modulation are predicted to rival Ⅲ-Ⅴ materials due to a larger electron population in the direct valley, reduced intervalley scattering, suppressed Auger recombination, and increased overlap integral for a stronger fundamental optical transition.
机译:紧凑的光学互连需要与硅兼容的高效激光器和调制器。使用密度泛函理论和HSE06混合泛函对Ge_(1-x)C_x(x = 0.78%)进行从头算建模,可以预测Γ处的导带分裂和强烈的直接带隙,这与谱带反交叉一致。 Ge_(0.998)C_(0.002)的光反射显示出带隙的减小支持了这些结果。以四(锗)甲烷为碳源的Ge_(0.998)C_(0.002)的生长没有CC键,C簇或扩展缺陷的迹象,表明C的高度取代结合。光学增益和调制预计可与Ⅲ竞争-Ⅴ材料是由于在直接波谷中具有更大的电子种群,减少了intervalley散射,抑制了俄歇复合并且增加了重叠积分以实现更强的基本光学跃迁。

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  • 来源
    《Journal of Applied Physics》 |2016年第5期|053102.1-053102.6|共6页
  • 作者单位

    Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA;

    Rigetti Quantum Computing, 775 Heinz Avenue, Berkeley, California 94710, USA;

    Honeywell UOP, Des Plaines, Illinois 60016, USA;

    Department of Chemical and Biomolecular Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA;

    Department of Chemistry, Syracuse University, Syracuse, New York 13244, USA;

    Department of Chemistry and Biochemistry, University of Notre Dame, Notre Dame, Indiana 46556, USA;

    Department of Physics and Materials Science, City University of Hong Kong, Hong Kong, China;

    Institute of Physics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27,50-370 Wroclaw, Poland;

    Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA;

    Department of Electrical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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