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Junction field effect transistor structure with P-type silicon germanium or silicon germanium carbide gate(s) and method of forming the structure

机译:具有p型硅锗或碳化硅锗栅极的结型场效应晶体管结构及其形成方法

摘要

Disclosed are embodiments of a junction field effect transistor (JFET) structure with one or more P-type silicon germanium (SiGe) or silicon germanium carbide (SiGeC) gates (i.e., a SiGe or SiGeC based heterojunction JFET). The P-type SiGe or SiGeC gate(s) allow for a lower pinch off voltage (i.e., lower Voff) without increasing the on resistance (Ron). Specifically, SiGe or SiGeC material in a P-type gate limits P-type dopant out diffusion and, thereby ensures that the P-type gate-to-N-type channel region junction is more clearly defined (i.e., abrupt as opposed to graded). By clearly defining this junction, the depletion layer in the N-type channel region is extended. Extending the depletion layer in turn allows for a faster pinch off (i.e., requires lower Voff). P-type SiGe or SiGeC gate(s) can be incorporated into conventional lateral JFET structures and/or vertical JFET structures. Also disclosed herein are embodiments of a method of forming such a JFET structure.
机译:公开了具有一个或多个P型硅锗(SiGe)或碳化硅锗(SiGeC)栅极(即,基于SiGe或SiGeC的异质结JFET)的结型场效应晶体管(JFET)结构的实施例。 P型SiGe或SiGeC栅极在不增加导通电阻(Ron)的情况下允许较低的夹断电压(即,较低的Voff)。具体而言,P型栅极中的SiGe或SiGeC材料可限制P型掺杂剂向外扩散,从而确保更清晰地定义P型栅极与N型沟道区域的结点(即突变而不是渐变) )。通过清楚地定义该结,扩展了N型沟道区域中的耗尽层。依次延长耗尽层允许更快的夹断(即,需要较低的Voff)。可以将P型SiGe或SiGeC栅极结合到常规的横向JFET结构和/或垂直JFET结构中。本文还公开了形成这种JFET结构的方法的实施例。

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