首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters >Improved Charge-Trapping Nonvolatile Memory with Dy-doped HfO_2 as Charge-Trapping Layer and Al_2O_3 as Blocking Layer
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Improved Charge-Trapping Nonvolatile Memory with Dy-doped HfO_2 as Charge-Trapping Layer and Al_2O_3 as Blocking Layer

机译:以Dy掺杂的HfO_2作为电荷陷阱层和Al_2O_3作为阻挡层的改进的电荷陷阱非易失性存储器

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摘要

We have investigated a charge-trapping nonvolatile memory (NVM) device with high-k dielectrics as a charge-trapping layer (HfO_2 and Dy-doped HfO_2) and a blocking layer (Al_2O_3). Compared with a conventional SiO_2/Si_3N_4/SiO_2 stack, both SiO_2/HfO_2/Al_2O_3 and SiO_2/Dy-doped HfO_2/Al_2O_3 stacks show significantly improved program and erase (P/E) speed The improvement in P/E speed characteristics can be explained by the larger band offset of HfO_2 and the increased thickness of the blocking oxide, which are the main advantages of high-k materials. Moreover, for a SiO_2/Dy-doped HfO_2/Al_2O_3 stack with an optimum Dy concentration, the enhanced retention characteristics were observed at a measurement temperature below 150℃ due to the deep energy level of the charge trap.
机译:我们已经研究了具有高k电介质作为电荷捕获层(HfO_2和Dy掺杂的HfO_2)和阻挡层(Al_2O_3)的电荷捕获非易失性存储(NVM)器件。与传统的SiO_2 / Si_3N_4 / SiO_2叠层相比,SiO_2 / HfO_2 / Al_2O_3和SiO_2 / Dy掺杂的HfO_2 / Al_2O_3叠层均显示出显着提高的编程和擦除(P / E)速度。可以解释P / E速度特性的改善。 HfO_2的较大带隙偏移和阻挡氧化物的厚度增加是高k材料的主要优点。此外,对于具有最佳Dy浓度的SiO_2 / Dy掺杂的HfO_2 / Al_2O_3叠层,由于电荷陷阱的深能级,在低于150℃的测量温度下观察到增强的保留特性。

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