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首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters >Structural Properties of GaN Buffer Layers on 4H-SiC(0001) Grown by Plasma-Assisted Molecular Beam Epitaxy for High Electron Mobility Transistors
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Structural Properties of GaN Buffer Layers on 4H-SiC(0001) Grown by Plasma-Assisted Molecular Beam Epitaxy for High Electron Mobility Transistors

机译:等离子体辅助分子束外延生长高电子迁移率晶体管的4H-SiC(0001)上GaN缓冲层的结构特性

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摘要

The structural properties of GaN buffer layers grown on 4H-SiC(0001) by plasma-assisted molecular beam epitaxy were investigated. Films grown under intermediate and N-rich conditions exhibited lower dislocation densities and lower residual lattice mismatch strain than Ga-rich grown films. To overcome the rough surfaces associated with intermediate and N-rich growth, two-step GaN buffers were investigated where the first layer was grown in the intermediate growth regime and the second layer at the boundary to Ga droplet formation. It is demonstrated that for our growth conditions a buffer thickness of 100 nm grown in intermediate conditions was necessary and sufficient for dislocation reduction. High electron mobility transistor structures grown using this Ga-flux strategy exhibit mobilities, power densities and power added efficiencies in excess of 1400cm~2/V·s, 12W/mm and 46% at 4GHz, respectively.
机译:研究了等离子体辅助分子束外延在4H-SiC(0001)上生长的GaN缓冲层的结构性能。与富Ga的生长膜相比,在富氮和中等条件下生长的膜表现出更低的位错密度和更低的残余晶格失配应变。为了克服与中间和富氮生长相关的粗糙表面,研究了两步GaN缓冲液,其中第一层以中间生长方式生长,第二层在Ga液滴形成的边界处生长。结果表明,对于我们的生长条件,在中间条件下生长100 nm的缓冲层厚度对于减少位错是必要的,并且足以减少位错。使用这种Ga-flux策略生长的高电子迁移率晶体管结构在4 GHz时的迁移率,功率密度和功率附加效率分别超过1400cm〜2 / V·s,12W / mm和46%。

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