首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers & Short Notes >Deep Sub-Micron Device and Analog Circuit Parameter Sensitivity to Process Variations with Halo Doping and Its Effect on Circuit Linearity
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Deep Sub-Micron Device and Analog Circuit Parameter Sensitivity to Process Variations with Halo Doping and Its Effect on Circuit Linearity

机译:深亚微米器件和模拟电路参数对光晕掺杂工艺变化的敏感性及其对电路线性的影响

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摘要

Single halo (SH) and double halo (DH) metal oxide semiconductor field effect transistors (MOSFETs) have been reported to exhibit excellent short channel performance in the sub 100 nm regime. In this work, the effect of process variations such as gate oxide thickness, implantation parameters, channel length and temperature are systematically investigated on the device and analog circuit performance for all these technologies. Our simulation results on differential amplifiers and current mirrors show that, for an identical V_t mismatch in conventional (CON), DH, and SH devices, SH MOSFETs show a lower variation in the circuit parameters. It is found that, for a specified circuit parameter variation, almost a 25% higher V_t mismatch is tolerable with SH technologies as compared to the CON technologies. We also report in this work that, better saturation characteristics observed with SH devices improve the linearity of amplifiers when compared with the CON and DH devices, biased at identical voltage gains. However, one needs to account for the increased body bias induced non-linearity with SH technologies as demonstrated using circuit simulations for source follower and simple sample and hold circuits.
机译:据报道,单光晕(SH)和双光晕(DH)金属氧化物半导体场效应晶体管(MOSFET)在低于100 nm的状态下表现出出色的短沟道性能。在这项工作中,系统地研究了所有这些技术对器件和模拟电路性能的影响,例如栅极氧化层厚度,注入参数,沟道长度和温度等工艺变化的影响。我们在差分放大器和电流镜上的仿真结果表明,对于常规(CON),DH和SH器件中相同的V_t失配,SH MOSFET的电路参数变化较小。已经发现,对于特定的电路参数变化,与CON技术相比,SH技术可忍受的V_t失配率高出近25%。我们还在这项工作中报告,与CON和DH器件相比,在相同的电压增益下偏置时,SH器件观察到的更好的饱和特性改善了放大器的线性。然而,需要使用SH技术解决体偏置引起的非线性增加的问题,如使用针对源极跟随器的电路仿真以及简单的采样和保持电路所证明的那样。

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